SLVSGS9D March   2023  – March 2024 TPS61299

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Boost Control Operation
      2. 7.3.2  Version Detection
      3. 7.3.3  Under-voltage Lockout
      4. 7.3.4  Switching Frequency
      5. 7.3.5  Input Current Limit
      6. 7.3.6  Enable and Disable
      7. 7.3.7  Soft-Start Timing
      8. 7.3.8  Down Mode
      9. 7.3.9  Pass-Through Operation
      10. 7.3.10 Output Short-to-Ground Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fast Load Transient Mode and Normal Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application-Li-ion Battery to 5V Boost Converter Under Fast Mode
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Maximum Output Current
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Typical Application-Li-ion Battery to 5V Boost Converter Under Normal Mode
      1. 8.3.1 Design Requirements
      2. 8.3.2 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
    6. 8.6 Thermal Information
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS61299 TPS61299 TPS61299 TPS61299 UNIT
YBH 6-BALLS YBH 6-BALLS DRL 6-PINS DRL-6PINS
Standard EVM Standard EVM
RθJA Junction-to-ambient thermal resistance 130.0 107.1 135.6 93.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.9 N/A 66.3 N/A °C/W
RθJB Junction-to-board thermal resistance 39.4 N/A 24.6 N/A °C/W
ΨJT Junction-to-top characterization parameter 0.2 4.1 1.6 7.9 °C/W
ΨJB Junction-to-board characterization parameter 39.4 62.7 24.4 39.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.