SLVS417F March   2002  – June 2015 TPS62200 , TPS62201 , TPS62202 , TPS62203 , TPS62204 , TPS62205 , TPS62207 , TPS62208

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Dynamic Voltage Positioning
      3. 7.3.3 Soft Start
      4. 7.3.4 Low Dropout Operation 100% Duty Cycle
      5. 7.3.5 Enable
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Save Mode Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Adjustable Output Voltage Version
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Various Output Voltages
      2. 8.3.2 Adjustable Output Voltage Version Set to 1.5 V
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VI Supply voltages(2) –0.3 7.0 V
Voltages on pins SW, EN, FB (2) –0.3 VCC +0.3 V
PD Continuous power dissipation See Thermal Information
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VI Supply voltage 2.5 6.0 V
VO Output voltage for adjustable output voltage version 0.7 VI V
IO Output current 300 mA
L Inductor(1) 4.7 10 µH
CI Input capacitor(1) 4.7 µF
CO Output capacitor(1) 10 µF
TA Operating ambient temperature 40 85 °C
TJ Operating junction temperature 40 125 °C
(1) See Application and Implementation for further information.

6.4 Thermal Information

THERMAL METRIC(1) TPS6220x UNIT
DBV [SOT-23]
5 PINS
RθJA Junction-to-ambient thermal resistance 220 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 125 °C/W
RθJB Junction-to-board thermal resistance 36 °C/W
ψJT Junction-to-top characterization parameter 14 °C/W
ψJB Junction-to-board characterization parameter 35 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VI = 3.6 V, VO = 1.8 V, IO = 200 mA, EN = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VI Input voltage 2.5 6 V
IQ Operating quiescent current IO = 0 mA, Device is not switching 15 30 µA
Shutdown supply current EN = GND 0.1 1 µA
Undervoltage lockout threshold 1.5 2 V
ENABLE
V(EN) EN high level input voltage 1.3 V
EN low level input voltage 0.4 V
I(EN) EN input bias current EN = GND or VIN 0.01 0.1 µA
POWER SWITCH
rds(ON) P-channel MOSFET on-resistance VIN = VGS = 3.6 V 530 690 mΩ
VIN = VGS = 2.5 V 670 850
N-channel MOSFET on-resistance VIN = VGS = 3.6 V 430 540 mΩ
VIN = VGS = 2.5 V 530 660
Ilkg_(P) P-channel leakage current VDS = 6.0 V 0.1 1 µA
Ilkg_(N) N-channel leakage current VDS = 6.0 V 0.1 1 µA
I(LIM) P-channel current limit 2.5 V < Vin < 6.0 V 380 480 670 mA
OSCILLATOR
fS Switching frequency 650 1000 1500 kHz
OUTPUT
VO Adjustable output voltage TPS62200 0.7 VIN V
Vref Reference voltage 0.5 V
Feedback voltage (1) TPS62200 VI = 3.6 V to 6 V, IO = 0 mA 0% 3%
Adjustable VI = 3.6 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
VO Fixed output voltage(1) TPS62207 VI = 2.5 V to 6 V, IO = 0 mA 0% 3%
1.2 V VI = 2.5 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
TPS62201 VI = 2.5 V to 6 V, IO = 0 mA 0% 3%
1.5 V VI = 2.5 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
TPS62204 VI = 2.5 V to 6 V, IO = 0 mA 0% 3%
1.6 V VI = 2.5 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
TPS62202 VI = 2.5 V to 6 V, IO = 0 mA 0% 3%
1.8 V VI = 2.5 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
TPS62208 VI = 2.5 V to 6 V, IO = 0 mA 0% 3%
1.875 V VI = 2.5 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
TPS62205 VI = 2.7 V to 6 V, IO = 0 mA 0% 3%
2.5 V VI = 2.7 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
TPS62203 VI = 3.6 V to 6 V, IO = 0 mA 0% 3%
3.3 V VI = 3.6 V to 6 V, 0 mA ≤ IO ≤ 300 mA –3% 3%
Line regulation VI = 2.5 V to 6 V, IO = 10 mA 0.26 %/V
Load regulation IO = 100 mA to 300 mA 0.0014 %/mA
Ilkg Leakage current into SW pin Vin > Vout, 0 V ≤ Vsw ≤ Vin 0.1 1 µA
Ilkg(Rev) Reverse leakage current into pin SW Vin = open, EN = GND, VSW = 6 V 0.1 1 µA
(1) For output voltages ≤ 1.2 V, a 22-µF output capacitor value is required to achieve a maximum output voltage accuracy of 3% while operating in power save mode (PFM mode).

6.6 Typical Characteristics

Table 1. Table of Graphs

FIGURES
η Efficiency vs Load current Figure 6, Figure 7, Figure 8
vs Input voltage Figure 9
IQ No load quiescent current vs Input voltage Figure 1
fs Switching frequency vs Temperature Figure 10
Vo Output voltage vs Output current Figure 11
rds(on) rds(on) - P-channel switch, vs Input voltage Figure 2
rds(on) - N-channel rectifier switch vs Input voltage Figure 3
Line transient response Figure 12
Load transient response Figure 13
Power save mode operation Figure 14
Start-up Figure 15
TPS62200 TPS62201 TPS62202 TPS62203 TPS62204 TPS62205 TPS62207 TPS62208 tc_quiescent_lvs417.gif
Figure 1. No Load Quiescent Current vs Input Voltage
TPS62200 TPS62201 TPS62202 TPS62203 TPS62204 TPS62205 TPS62207 TPS62208 tc_nchannel_lvs417.gif
Figure 3. rds(on) N-Channel Switch vs Input Voltage
TPS62200 TPS62201 TPS62202 TPS62203 TPS62204 TPS62205 TPS62207 TPS62208 tc_pchannel_lvs417.gif
Figure 2. rds(on) P-Channel Switch vs Input Voltage