SLVSDV6C November   2017  – November 2019 TPS62821 , TPS62822 , TPS62823

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Schematic space space space space
      2.      Efficiency vs Output Current space
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable / Shutdown and Output Discharge
      2. 8.3.2 Soft-Start
      3. 8.3.3 Power Good (PG)
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode (PSM) Operation
      3. 8.4.3 Minimum Duty Cycle and 100% Mode Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting the Adjustable Output Voltage
        3. 9.2.2.3 Feed-forward Capacitor Selection
        4. 9.2.2.4 Output Filter Selection
        5. 9.2.2.5 Inductor Selection
        6. 9.2.2.6 Output Capacitor Selection
        7. 9.2.2.7 Input Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

The recommended PCB layout for the TPS6282x is shown below. It ensures best electrical and optimized thermal performance considering the following important topics:

- The input capacitor(s) must be placed as close as possible to the VIN and PGND pins of the device. This provides low resistive and inductive paths for the high di/dt input current.

- The SW node connection from the IC to the inductor conducts alternating high currents. It should be kept short.

- The VOUT regulation loop is closed with COUT and its ground connection. To avoid load regulation and EMI noise, the loop should be kept short.

- The FB node is sensitive to dv/dt signals. Therefore the resistive divider should be placed close to the FB and AGND pins.

For more detailed information about the actual EVM solution, see the EVM users guide.