SLUSDU8F September   2019  – October 2023 TPS62860 , TPS62861

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Characteristics
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Save Mode
      2. 8.3.2  Forced PWM Operation
      3. 8.3.3  Smart Enable and Shutdown (EN)
      4. 8.3.4  Soft Start
      5. 8.3.5  Output Voltage Selection (VSEL) for TPS62860x
      6. 8.3.6  Output Voltage Selection (VSEL and I2C)
      7. 8.3.7  Forced PWM Mode During Output Voltage Change
      8. 8.3.8  Undervoltage Lockout (UVLO)
      9. 8.3.9  Power Good (PG)
      10. 8.3.10 Switch Current Limit and Short Circuit Protection
      11. 8.3.11 Thermal Shutdown
      12. 8.3.12 Output Voltage Discharge
    4. 8.4 Programming
      1. 8.4.1 Serial Interface Description
      2. 8.4.2 Standard- and Fast-Mode Protocol
      3. 8.4.3 I2C Update Sequence
      4. 8.4.4 I2C Register Reset
    5. 8.5 Register Map
      1. 8.5.1 Slave Address Byte
      2. 8.5.2 Register Address Byte
      3. 8.5.3 VOUT Register 1
      4. 8.5.4 VOUT Register 2
      5. 8.5.5 CONTROL Register
      6. 8.5.6 STATUS Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application, TPS628610
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application, TPS628600, TPS62860x
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
YCH (DSBGA)
8 PINs
RθJA Junction-to-ambient thermal resistance 121.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.1 °C/W
RθJB Junction-to-board thermal resistance 33.7 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 33.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.