SLVSAM8D July   2013  – August 2019 TPS63050 , TPS63051

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic (WCSP)
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Good
      2. 8.3.2 Overvoltage Protection
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Soft Start
      6. 8.3.6 Short Circuit Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Loop Description
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 Adjustable Current Limit
      4. 8.4.4 Device Enable
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Output Filter Design
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Capacitor selection
          1. 9.2.2.4.1 Input Capacitor
          2. 9.2.2.4.2 Output Capacitor
        5. 9.2.2.5 Setting the Output Voltage
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example (WCSP)
    3. 11.3 Layout Example (HotRod)
    4. 11.4 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Custom Design With WEBENCH® Tools
    2. 12.2 Device Support
      1. 12.2.1 Third-Party Products Disclaimer
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS6305x UNIT
WCSP RMW
12 PINS 12 PINS
RθJA Junction-to-ambient thermal resistance 89.9 37.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.7 30.4 °C/W
RθJB Junction-to-board thermal resistance 43.9 8.0 °C/W
ψJT Junction-to-top characterization parameter 2.9 0.4 °C/W
ψJB Junction-to-board characterization parameter 43.7 7.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 2.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.