SLVSBM1H June 2013 – November 2016 TPS65132
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
The TPS65132 device is available in a 15-bump chip scale package (YFF, NanoFree™). The package dimensions are given as:
• D = 2108 ±30 μm
• E = 1514 ±30 μm