SLVS338T May   2001  – December 2022 TPS715

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4.     Thermal Information
    5. 6.4 Electrical Characteristics
    6. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Wide Supply Range
      2. 7.3.2 Low Quiescent Current
      3. 7.3.3 Dropout Voltage (VDO)
      4. 7.3.4 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Setting VOUT for the TPS71501 Adjustable LDO
        2. 8.2.1.2 External Capacitor Requirements
        3. 8.2.1.3 Input and Output Capacitor Requirements
        4. 8.2.1.4 Reverse Current
        5. 8.2.1.5 Feed-Forward Capacitor (CFF)
        6. 8.2.1.6 Power Dissipation (PD)
        7. 8.2.1.7 Estimating Junction Temperature
      2. 8.2.2 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Power Dissipation
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
        2. 9.1.1.2 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2 Application Curves

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater), IOUT = 1 mA, CIN = 1 µF, and COUT = 1 µF (unless otherwise noted)

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Figure 8-4 Power-Up and Power-Down for Legacy Chip
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Figure 8-6 Line Transient Response for Legacy Chip
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Figure 8-8 Load Transient Response for Legacy Chip
 
Figure 8-10 Dropout Exit Transient Response for New Chip
Figure 8-5 Power-Up and Power-Down for New Chip
 
Figure 8-7 Line Transient Response for New Chip
 
Figure 8-9 Load Transient Response for New Chip
 
Figure 8-11 Fast Line Transient Response for New Chip