SBVS141D April   2010  – December 2023 TPS74701-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics: IOUT = 50 mA
    7. 5.7 Typical Characteristics: VEN = VIN = 1.8 V, VOUT = 1.5 V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Transient Response
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Output Noise
      4. 6.3.4 Enable and Shutdown
      5. 6.3.5 Power Good
      6. 6.3.6 Internal Current Limit
      7. 6.3.7 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input, Output, and Bias Capacitor Requirements
        2. 7.2.2.2 Programmable Soft-Start
        3. 7.2.2.3 Sequencing Requirements
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layout Recommendations and Power Dissipation
        2. 7.4.1.2 Estimating Junction Temperature
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision C (October 2023) to Revision D (December 2023)

  • Added device verbiage throughout document to differentiate legacy chip and new chip informationGo
  • Updated Turn On Response plot to display New Chip performanceGo
  • Changed Typical Characteristics sections to show legacy chip and new chip data side by side and deleted VIN Dropout Voltage vs VBIAS-VOUT curvesGo
  • Added soft-start time for new chip in Standard Capacitor Values for Programming the Soft-Start Time tableGo
  • Changed Device Nomenclature sectionGo

Changes from Revision B (September 2016) to Revision C (October 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Added M3-specific devices to documentGo
  • Changed automotive-specific Features bulletsGo
  • Changed VIN range, Low dropout, Accuracy, and packages Features bullets: Deleted Ultra-low from VIN range bullet, changed 50 mV to 20 mV in Low dropout bullet, and changed 2% to 0.95% in Accuracy bullet, and deleted × 1-mm from package bulletGo
  • Changed Applications sectionGo
  • Changed Description sectionGo
  • Changed Description column of Pin Functions tableGo
  • Changed Typical Characteristics and added new Typical Characteristics sectionsGo
  • Changed footnote for Standard Capacitor Values for Programming the Soft-Start Time tableGo
  • Changed Layout sectionGo
  • Added Device Nomenclature sectionGo