SBVS080J September   2006  – November 2016 TPS75100 , TPS75103 , TPS75105

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Load Regulation
      2. 7.3.2 Line Regulation
    4. 7.4 Device Functional Modes
      1. 7.4.1 LED ON
      2. 7.4.2 LED OFF
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Setting the Output Current Level
      2. 8.1.2 Limitations on LED Forward Voltages
      3. 8.1.3 Use of External Capacitors
      4. 8.1.4 Use of Unused Outputs or Tying Outputs Together
      5. 8.1.5 Use of Enable Pins for PWM Dimming
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DSK|10
  • YFF|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

YFF Package
9-Pin DSBGA
Top View
TPS75100 TPS75103 TPS75105 po_bvs080.gif
DSK Package
10-Pin WSON
Top View
TPS75100 TPS75103 TPS75105 po_dsk_update_bvs080.gif

Pin Functions

PIN I/O DESCRIPTION
NAME WCSP WSON
ENA A3 2 I Enable pin, Bank A. Driving this pin high turns on the current source to Bank A outputs. Driving this pin low turns off the current source to Bank A outputs. An applied PWM signal reduces the LED current (between 0 mA and the maximum current set by ISET) as a function of the duty cycle of the PWM signal. ENA and ENB can be tied together. ENA can be left OPEN or connected to GND if not used. See the Application and Implementation section for more details.
D1A B3 3 O Diode source current output, Bank A. Connect to LED anode.
D2A C3 4 O Diode source current output, Bank A. Connect to LED anode.
ENB A2 1 I Enable pin, Bank B. Driving this pin high turns on the current source to Bank B outputs. Driving this pin low turns off the current source to Bank B outputs. An applied PWM signal reduces the LED current (between 0 mA and the maximum current set by ISET) as a function of the duty cycle of the PWM signal. ENA and ENB can be tied together. ENB can be left OPEN or connected to GND if not used. See the Application and Implementation section for more details.
VIN B2 9 I Supply input
GND C2 5, Pad Ground
ISET A1 10 I An optional resistor can be connected between this pin and GND to set the maximum current through the LEDs. If no resistor is connected, ISET defaults to the internally programmed value.
D1B B1 8 O Diode source current output, Bank B. Connect to LED anode.
D2B C1 7 O Diode source current output, Bank B. Connect to LED anode.
NC 6 Not internally connected