SBVS330A September   2017  – October 2017 TPS79901-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Start Up
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Output Noise
        3. 8.2.2.3 Dropout Voltage
        4. 8.2.2.4 Transient Response
        5. 8.2.2.5 Minimum Load
        6. 8.2.2.6 Feedback Capacitor Requirements
      3. 8.2.3 Application Curve
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Thermal Information
        1. 10.1.2.1 Thermal Protection
        2. 10.1.2.2 Power Dissipation
        3. 10.1.2.3 Package Mounting
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage(2) IN –0.3 7 V
EN –0.3 VIN + 0.3
OUT –0.3 VIN + 0.3
Current OUT Internally limited mA
Temperature Operating virtual junction, TJ –55 150 °C
Storage temperature range, Tstg –55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±1500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage(1) 2.7 6.5 V
IOUT Output current 0.5 200 mA
TJ Operating junction temperature –55 125 °C
(1) Minimum VIN = VOUT + VDO or 2.7 V, whichever is greater.

6.4 Thermal Information

THERMAL METRIC(1) TPS799 UNIT
DRV (SON)
6 PINS
RθJA Junction-to-ambient thermal resistance 74.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.8 °C/W
RθJB Junction-to-board thermal resistance 145.9 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 54.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.2 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

at TJ = –55°C to +125°C, VIN = VOUT(nom) + 0.3 V or 2.7 V, whichever is greater; IOUT = 1 mA, VEN = VIN, COUT = 2.2 μF, CNR = 0.01 μF, and VOUT = 3 V (unless otherwise noted). Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2.7 6.5 V
VFB Internal reference 1.169 1.193 1.217 V
VOUT Output voltage range VFB 6.5 – VDO V
Output accuracy, nominal TJ = 25°C –1% 1%
Output accuracy(1)
over VIN, IOUT, temperature		 VOUT + 0.3 V ≤ VIN ≤ 6.5 V
500 μA ≤ IOUT ≤ 200 mA		 –2% ±1% 2%
ΔVO(ΔVI) Line regulation(1) VOUT(NOM) + 0.3 V ≤ VIN ≤ 6.5 V 0.02 %/V
ΔVO(ΔIO) Load regulation 500 μA ≤ IOUT ≤ 200 mA 0.002 %/mA
VDO Dropout voltage(1)
(VIN = VOUT(nom) – 0.1 V)		 IOUT = 200 mA VOUT(nom) ≤ 3.3 V 100 175 mV
VOUT(nom) ≥ 3.3 V 90 160
ICL Output current limit VOUT = 0.9 × VOUT(nom) 220 400 600 mA
IGND Ground pin current 500 μA ≤ IOUT ≤ 200 mA 40 60 μA
ISHDN Shutdown current (IGND) VEN ≤ 0.4 V, 2.7 V ≤ VIN ≤ 6.5 V 0.15 1 μA
IFB Feedback pin current –0.5 0.5 µA
PSRR Power-supply rejection ratio VIN = 3.85 V,
VOUT = 2.85 V,
CNR = 0.01 μF,
IOUT = 100 mA		 f = 100 Hz 70 dB
f = 1 kHz 66
f = 10 kHz 51
f = 100 kHz 38
Vn Output noise voltage BW = 10 Hz to 100 kHz, VOUT = 2.85 V CNR = 0.01 μF 10.5 × VOUT μVRMS
CNR = none 94 × VOUT
Start-up time VOUT = 2.85 V,
RL = 14 Ω,
COUT = 2.2 μF		 CNR = 0.001 μF 45 μs
CNR = 0.047 μF 45
CNR = 0.01 μF 50
CNR = none 50
VEN(HI) Enable high (enabled) 1.2 VIN V
VEN(LO) Enable low (shutdown) 0 0.4 V
IEN(HI) Enable pin current, enabled VEN = VIN = 6.5 V 0.03 1 μA
UVLO Undervoltage lockout VIN rising 1.90 2.20 2.65 V
UVLO hysteresis VIN falling 70 mV
Tsd Thermal shutdown temperature Shutdown, temperature increasing 165 °C
Reset, temperature decreasing 145
(1) VDO is not measured for VOUT(nom) < 2.8 V because minimum VIN = 2.7 V.
TPS79901-EP D008_SBVS330.gif
1. See data sheet for absolute maximum and minimum recommended operating conditions.
2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life).
3. Enhanced plastic product disclaimer applies.
Figure 1. TPS79901-EP Derating Chart

6.6 Typical Characteristics

at TJ= –55°C to +125°C, VIN = VOUT(nom) + 0.3 V or 2.7 V, whichever is greater; IOUT = 1 mA, VEN = VIN, COUT = 2.2 μF, CNR = 0.01 μF, and VOUT = 3 V (unless otherwise noted). Typical values are at TJ = 25°C.
TPS79901-EP D001_SBVS330.gif
Figure 2. Load Regulation
TPS79901-EP D003_SBVS330.gif
Figure 4. Output Voltage vs Junction Temperature
TPS79901-EP D005_SBVS330.gif
Figure 6. Dropout Voltage vs Junction Temperature
TPS79901-EP tc_ignd-vin_sbvs330.gif
VOUT = 2.85 V
Figure 8. Ground Pin Current vs Input Voltage
TPS79901-EP D007_SBVS330.gif
Figure 10. Ground Pin Current (Disabled) vs Junction Temperature
TPS79901-EP tc_psrr02_sbvs330.gif
VIN – VOUT = 0.5 V VOUT = 2.85 V
CNR = 0.01 µF COUT = 2.2 µF
Figure 12. Power-Supply Ripple Rejection vs Frequency
TPS79901-EP tc_psrr04_sbvs330.gif
VIN – VOUT = 1 V VOUT = 2.85 V
CNR = 0.01 µF COUT = 10 µF
Figure 14. Power-Supply Ripple Rejection vs Frequency
TPS79901-EP tc_psrr06_sbvs330.gif
VIN – VOUT = 1 V VOUT = 2.85 V
COUT = 10 µF
Figure 16. Power-Supply Ripple Rejection vs Frequency
TPS79901-EP tc_psrr-vv2_sbvs330.gif
IOUT = 100 mA CNR = 0.01 µF
COUT = 2.2 µF
Figure 18. Power-Supply Ripple Rejection vs VIN – VOUT
TPS79901-EP tc_noise-cnr_sbvs330.gif
VOUT = 2.85 V IOUT = 1 mA
COUT = 2.2 µF
Figure 20. Total Noise vs CNR
TPS79901-EP tc_ln-tr_sbvs330.gif
VOUT = 2.85 V IOUT = 150 mA
Figure 22. Line Transient Response
TPS79901-EP tc_turn_on_resp_bvs056.gif
VEN = VIN VOUT = 2.85 V
Figure 24. Turn-On Response
TPS79901-EP tc_pupd_sbvs330.gif
VOUT = 2.85 V RL = 19 Ω
Figure 26. Power-Up and Power-Down
TPS79901-EP D002_SBVS330.gif
Figure 3. Line Regulation
TPS79901-EP D004_SBVS330.gif
Figure 5. Dropout Voltage vs Output Current
TPS79901-EP tc_vdo_vin_sbvs330.gif
IOUT = 200 mA
Figure 7. Dropout vs Input Voltage
TPS79901-EP D006_SBVS330.gif
Figure 9. Ground Pin Current vs Junction Temperature
TPS79901-EP tc_psrr01_sbvs330.gif
VIN – VOUT = 1 V VOUT = 2.85 V
CNR = 0.01 µF COUT = 2.2 µF
Figure 11. Power-Supply Ripple Rejection vs Frequency
TPS79901-EP tc_psrr03_sbvs330.gif
VIN – VOUT = 0.25 V VOUT = 2.85 V
CNR = 0.01 µF COUT = 2.2 µF
Figure 13. Power-Supply Ripple Rejection vs Frequency
TPS79901-EP tc_psrr05_sbvs330.gif
VIN – VOUT = 0.25 V VOUT = 2.85 V
CNR = 0.01 µF COUT = 10 µF
Figure 15. Power-Supply Ripple Rejection vs Frequency
TPS79901-EP tc_psrr-vv1_sbvs330.gif
IOUT = 1 mA CNR = 0.01 µF
COUT = 2.2 µF
Figure 17. Power-Supply Ripple Rejection vs VIN – VOUT
TPS79901-EP tc_psrr-vv3_sbvs330.gif
IOUT = 200 mA CNR = 0.01 µF
COUT = 2.2 µF
Figure 19. Power-Supply Ripple Rejection vs VIN – VOUT
TPS79901-EP tc_noise-co_sbvs330.gif
VOUT = 2.85 V IOUT = 1 mA
CNR = 0.01 µF
Figure 21. Total Noise vs COUT
TPS79901-EP tc_ld_tr_sbvs330.gif
VIN = 3.35 V VOUT = 2.85 V
Figure 23. Load Transient Response
TPS79901-EP tc_enable_resp_sbvs330.gif
VIN = 3.85 V VOUT = 2.85 V
Figure 25. Enable Response