SBVS428 May   2022 TPS7A16A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 PG Delay Timer (DELAY)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Good
        1. 7.4.1.1 Power-Good Delay and Delay Capacitor
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 TPS7A16A Circuit as an Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Adjustable Voltage Operation
            1. 8.2.1.2.1.1 Resistor Selection
          2. 8.2.1.2.2 Capacitor Recommendations
          3. 8.2.1.2.3 Input and Output Capacitor Requirements
          4. 8.2.1.2.4 Feed-Forward Capacitor (Only for Adjustable Version)
          5. 8.2.1.2.5 Transient Response
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Additional Layout Considerations
      2. 10.1.2 Power Dissipation
      3. 10.1.3 Thermal Considerations
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at TA= –40°C to +125°C, VIN = VOUT(NOM) + 500 mV or VIN = 3 V (whichever is greater), VEN = VIN, IOUT = 10 μA, CIN = 2.2 μF, COUT = 2.2 μF, and FB tied to OUT (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VINInput voltage range360V
VREFInternal referenceTA = 25°C, VFB = VREF, VIN = 3 V, IOUT = 10 μA1.1691.1931.217V
VUVLOUndervoltage lockout threshold2V
VOUTOutput voltage rangeVIN ≥ VOUT(NOM) + 0.5 VVREF18.5V
Overall VOUT accuracyVOUT(NOM) + 0.5 V ≤ VIN ≤ 60 V(1),
10 μA ≤ IOUT ≤ 100 mA		–2%2%
ΔVO(ΔVI)Line regulation3 V ≤ VIN ≤ 60 V ±1%VOUT
ΔVO(ΔIO)Load regulation10 μA ≤ IOUT ≤ 100 mA±1%VOUT
VDODropout voltageVIN = 0.95xVOUT(NOM), IOUT = 20 mA60mV
VIN = 0.95 × VOUT(NOM), IOUT = 100 mA265500
ILIMCurrent limitVOUT = 90% VOUT(NOM), VIN = VOUT(NOM) + 1 V(3)101225400mA
VOUT = 90% VOUT(NOM), VIN = 3 V(4)101225400
IGNDGround current3 V ≤ VIN ≤ 60 V, IOUT = 10 μA515μA
IOUT = 100 mA, VOUT = 1.2 V60
ISHDNShutdown supply currentVEN = 0.4 V, VIN = 12 V0.595.0μA
I FBFeedback current(2)–101μA
IENEnable current3 V ≤ VIN ≤ 12 V, VIN = VEN–10.011μA
VEN_HIEnable high-level voltage1.2V
VEN_LOEnable low-level voltage0.3V
VITPG trip thresholdOUT pin floating, VFB increasing, VIN ≥ VIN_MIN8595%VOUT
OUT pin floating, VFB decreasing, VIN ≥ VIN_MIN8393
VHYSPG trip hysteresis2.3%VOUT
VPG, LOPG output low voltageOUT pin floating, VFB = 80% VREF, IPG = 100 μA0.4V
IPG, LKGPG leakage currentVPG = VOUT(NOM)–11μA
IDELAYDELAY pin current12μA
PSRRPower-supply rejection ratioVIN = 3 V, VOUT(NOM) = VREF, COUT = 10 μF,
f = 100 Hz		50dB
TSDThermal shutdown temperatureShutdown, temperature increasing175°C
Reset, temperature decreasing155
(1) Maximum input voltage is limited to 24 V because of the package power dissipation limitations at full load (P ≈ (VIN – VOUT) × IOUT =
(24 V – VREF) × 50 mA ≈ 1.14 W). The device is capable of sourcing a maximum current of 50 mA at higher input voltages as long as the power dissipated is within the thermal limits of the package plus any external heat sinking.
(2) IFB > 0 μA flows out of the device.
(3) For fixed output voltages only.
(4) For adjustable output only, where VOUT = 1.2 V.