SBVS324B June   2017  – September 2026 TPS7A90

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage (VDO)
      3. 6.3.3 Output Voltage Accuracy
      4. 6.3.4 High Power-Supply Rejection Ratio (PSRR)
      5. 6.3.5 Low Output Noise
      6. 6.3.6 Output Soft-Start Control
      7. 6.3.7 Power-Good Function
      8. 6.3.8 Internal Protection Circuitry
        1. 6.3.8.1 Undervoltage Lockout (UVLO)
        2. 6.3.8.2 Internal Current Limit (ICL)
        3. 6.3.8.3 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Output
      2. 7.1.2 Start-Up
        1. 7.1.2.1 Enable (EN) and Undervoltage Lockout (UVLO)
        2. 7.1.2.2 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
          1. 7.1.2.2.1 Noise Reduction
          2. 7.1.2.2.2 Soft-Start and In-Rush Current
      3. 7.1.3 Capacitor Recommendation
        1. 7.1.3.1 Input and Output Capacitor Requirements (CIN and COUT)
          1. 7.1.3.1.1 Load-Step Transient Response
        2. 7.1.3.2 Feed-Forward Capacitor (CFF)
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Board Layout
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 SPICE Models
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information