SBVS444B January   2025  – June 2025 TPS7B4260-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Tracker Output Voltage (VOUT)
        1. 6.3.1.1 Output Voltage Equal to Reference Voltage
        2. 6.3.1.2 Output Voltage Less Than the Reference Voltage
        3. 6.3.1.3 Output Voltage Larger than the Reference Voltage
      2. 6.3.2 Reverse Current Protection
      3. 6.3.3 Undervoltage Lockout
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Current Limit
      6. 6.3.6 Output Short to Battery
      7. 6.3.7 Tracking Regulator With an Enable Circuit
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Operation With VIN < 3.3V
      4. 6.4.4 Disable With ADJ/EN Control
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Dropout Voltage
      2. 7.1.2 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input and Output Capacitor Selection
        2. 7.2.2.2 Feedback Resistor Selection
        3. 7.2.2.3 Feedforward Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package Mounting
        2. 7.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
        3. 7.4.1.3 Power Dissipation and Thermal Considerations
        4. 7.4.1.4 Thermal Performance Versus Copper Area
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

For best overall performance, place all circuit components on the same side of the circuit board. Place these components as near as practical to the respective LDO pin connections. Place ground return connections of the input and output capacitor, as close as possible to the LDO ground pin. Use a wide, component-side, copper surface to make the connections between the two. Using vias and long traces to the input and output capacitors is strongly discouraged and negatively affects system performance. Use a ground reference plane either embedded in the PCB or located on the bottom side of the PCB opposite the components. This reference plane helps improve accuracy of the output voltage and provide shielding from noise. This plane behaves similarly to a thermal plane to spread (or sink) heat from the LDO device when connected to the thermal pad. In most applications, this ground plane is necessary to meet thermal requirements.