SLVSIA7 March   2025 TPSI3050M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristic Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Transmission of the Enable State
      2. 7.3.2  Power Transmission
      3. 7.3.3  Gate Driver
      4. 7.3.4  Modes Overview
      5. 7.3.5  Three-Wire Mode
      6. 7.3.6  Two-Wire Mode
      7. 7.3.7  VDDP, VDDH, and VDDM Undervoltage Lockout (UVLO)
      8. 7.3.8  Keep-Off Circuitry
      9. 7.3.9  Power Supply and EN Sequencing
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Two-Wire or Three-Wire Mode Selection
        2. 8.2.2.2 CDIV1, CDIV2 Capacitance
        3. 8.2.2.3 RPXFR Selection
        4. 8.2.2.4 CVDDP Capacitance
        5. 8.2.2.5 Gate Driver Output Resistor
        6. 8.2.2.6 Start-up Time and Recovery Time
        7. 8.2.2.7 Supplying Auxiliary Current, IAUX From VDDM
        8. 8.2.2.8 VDDM Ripple Voltage
      3. 8.2.3 Application Curves
      4. 8.2.4 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWZ|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Typical Application

The circuits in Figure 8-1 and Figure 8-2 show a typical application for driving silicon based MOSFETs in three-wire mode and two-wire mode, respectively.

TPSI3050M TPSI3050M Three-Wire Mode Driving MOSFETsFigure 8-1 TPSI3050M Three-Wire Mode Driving MOSFETs
TPSI3050M TPSI3050M Two-Wire Mode Driving MOSFETsFigure 8-2 TPSI3050M Two-Wire Mode Driving MOSFETs