SBOSA52B november   2022  – august 2023 TRF0206-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Quality Conformance Inspection
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Differential Amplifier
      2. 7.3.2 Single-Supply Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving a High-Speed ADC
      2. 8.1.2 Calculating Output Voltage Swing
      3. 8.1.3 Thermal Considerations
    2. 8.2 Typical Application
      1. 8.2.1 TRF0206-SP Driving an AFE7950-SP Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20230817-CA0I-LJQB-JM8H-PMQVLSWFWXWD-low.svg Figure 5-1 FFM Package, 12-Pin LCCC (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
GND 1, 4, 7, 10

GND

 Ground
INM 5 I Differential signal input, negative
INP 6 I Differential signal input, positive
OUTM 12 O Differential signal output, negative
OUTP 11 O Differential signal output, positive
PD

2

 I Power down signal. Supports 1.8‑V and 3.3‑V Logic.
0 = chip enabled
1 = power down
TP1 8 — Test pin. Short to ground.
TP2 3 — Test pin. Short to ground.
VDD 9 P 3.3-V supply
Thermal Pad pad — Thermal pad. Connect to ground on board.
(1) I = input, O = output, P = power, GND = Ground