SLASFD2 October   2025 TRF3302

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - GPS L1 Band
    6. 5.6 Electrical Characteristics - GPS L5 and L2 Bands
    7. 5.7 Typical Characteristics – GPS L1 Band
    8. 5.8 Typical Characteristics – GPS L5 and L2 Bands
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 The TRF3302 in a Multiband Configuration
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • VBL|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics - GPS L1 Band

at TA = 27°C, VCC = 2.5V, f = 1575MHz (L1 band), source impedance (ZS) = load impedance (ZL) = 50Ω, and input matched to 50Ω with L1 = 8.2nH (0402DC-8N2XGRW) and C1 = 10pF (GJM1555C1H100JB01) with input and output configuration as shown in Figure 6-2, de-embedded up to capacitor, C1, on input and RFOUT pin on the output (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RF PERFORMANCE
Operating frequency 1300 1575 1630 MHz
GP Small-signal power gain PIN = –27dBm VCC = 1.8V 12.3 16.9 19.5 dB
VCC = 2.5V 12.8 16.8 19.7
VCC = 3.3V 12.8 16.8 20.7
NF Noise figure VCC = 1.8V to 3.3V 0.85 dB
S11 Input return loss PIN = –27dBm, VCC = 1.8V to 3.3V –11.7 dB
S22 Output return loss PIN = –27dBm, VCC = 1.8V to 3.3V –15.3 dB
S12 Reverse isolation PIN = –27dBm, VCC = 1.8V to 3.3V –42.5 dB
IP1dB Input 1dB compression point No jammer VCC = 1.8V –13.2 dBm
VCC = 2V –11.7
VCC = 2.5V –14.7 –10.2
VCC > 2.5V –10.2
Input 1dB compression point fJAM = 850MHz, PJAM = –20dBm VCC = 1.8V –14.4 dBm
VCC ≥ 2.5V –10.7
Input 1dB compression point fJAM = 1850MHz, PJAM = –20dBm VCC = 1.8V –13.8 dBm
VCC ≥ 2.5V –10.8
IIP3 In-band input third-order
intercept point		 PIN = –25dBm/tone,
5MHz tone spacing		 VCC = 1.8V –5.5 dBm
VCC ≥ 2V –5.4
IIP3OOB Out-of-band input third-order
intercept point		 PIN = –25dBm/tone, at f = 1575MHz with out-of-band f1 = 1713MHz and
f2 = 1851MHz		 VCC = 1.8V –5.7 dBm
VCC = 2V –5.2
VCC ≥ 2.2V –4.8
K Rollett stability factor 1
DC PARAMETERS
VCC Supply voltage 1.8 3.3 V
ICC Active supply current VCC = 1.8V, no RF 3 4.6 5.9 mA
VCC = 2.5V, no RF 3.2 4.6 5.9 mA
VCC = 3.3V, no RF 3.2 4.6 7 mA
Active power dissipation VCC = 1.8V, no RF 8.3 10.6 mW
VCC = 2.5V, no RF 11.5 14.8
VCC = 3.3V, no RF 15.2 23.1
ISHDN Shutdown supply current VCC = 1.8V, no RF 0.01 1 µA
VCC = 2.5V, no RF 0.01 1
VCC = 3.3V, no RF 0.05
tON Turn-on time 50% EN control to 90% PO 1.4 µs
tOFF Turn-off time 50% EN control to 10% PO 0.4 µs
POWER DOWN CONTROL LEVELS
VIH High-level input voltage Logic 1, VCC = 1.8V to 3.3V 1.5 V
VIL Low-level input voltage Logic 0, VCC = 1.8V to 3.3V 0.4 V