SLOU186G August   2006  – May 2017 TRF7960 , TRF7961


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Power Supplies
      1. 6.2.1 Negative Supply Connections
      2. 6.2.2 Digital I/O Interface
      3. 6.2.3 Supply Regulator Configuration
      4. 6.2.4 Power Modes
      5. 6.2.5 Timing Diagrams
    3. 6.3 Receiver - Analog Section
      1. 6.3.1 Received Signal Strength Indicator (RSSI)
      2. 6.3.2 Receiver - Digital Section
      3. 6.3.3 Transmitter
        1. Transmitter - Analog Section
        2. Transmitter - Digital Section
      4. 6.3.4 Direct Mode
      5. 6.3.5 Register Preset
    4. 6.4 Register Descriptions
      1. 6.4.1 Control Registers - Main Configuration Registers
      2. 6.4.2 Control Registers - Sublevel Configuration Registers
      3. 6.4.3 Status Registers
      4. 6.4.4 FIFO Control Registers
    5. 6.5 Direct Commands From MCU to Reader
      1. 6.5.1  Command Codes
      2. 6.5.2  Reset FIFO
      3. 6.5.3  Transmission With CRC
      4. 6.5.4  Transmission Without CRC
      5. 6.5.5  Delayed Transmission With CRC
      6. 6.5.6  Delayed Transmission Without CRC
      7. 6.5.7  Transmit Next Time Slot
      8. 6.5.8  Receiver Gain Adjust
      9. 6.5.9  Test External RF (RSSI at RX Input With TX Off)
      10. 6.5.10 Test Internal RF (RSSI at RX Input With TX On)
      11. 6.5.11 Block Receiver
      12. 6.5.12 Enable Receiver
    6. 6.6 Reader Communication Interface
      1. 6.6.1 Introduction
    7. 6.7 Parallel Interface Communication
      1. 6.7.1 Receive
      2. 6.7.2 Transmit
    8. 6.8 Serial Interface Communication
      1. 6.8.1 SPI Without SS* (Slave Select) Pin
      2. 6.8.2 SPI With SS* (Slave Select) Pin
        1. FIFO Operation
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Schematics
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Getting Started and Next Steps

For more information on the TI NFC/RFID devices and the tools and software that are available to help with your development, visit Overview for NFC / RFID.

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of devices. Each commercial family member has one of three prefixes: x, p, or no prefix. These prefixes represent evolutionary stages of product development from engineering prototypes (with prefix x) through fully qualified production devices (with no prefix).

Device development evolutionary flow:

xTRF... – Experimental device that is not necessarily representative of the electrical specifications of the final device

pTRF... – Final device that conforms to the electrical specifications of the final product but has not completed quality and reliability verification

TRF... – Fully qualified production device

Devices with a prefix of x or p are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type and, optionally, the temperature range. Figure 8-1 provides a legend for reading the complete device name.

TRF7960 TRF7961 trf7960a-device-nomenclature.gif Figure 8-1 Device Nomenclature

Tools and Software

Design Kits and Evaluation Modules

    TRF7960A Evaluation Module The TRF7960EVM let the software application developer experiment with the functions of the TRF796x multiple-standard fully integrated 13.56-MHz RFID analog front end and data framing reader system.
    TRF7960A Target Board The TRF7960ATB EVM lets the software application developer experiment with the functions of the TRF796x multiple-standard fully integrated 13.56-MHz RFID writer/reader IC on the Texas Instruments embedded microcontroller platform of choice without having to worry about the RF section.


Documentation Support

The following documents describe the TRF7960 and TRF7961 devices. Copies of these documents are available on the Internet at

Receiving Notification of Document Updates

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on (for links to the product folders, see Section 8.5). In the upper-right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

Application Notes

    TRF796x Software Design Hints This application report provides guidance on designing software that works around certain device and protocol limitations.
    Management of the TRF7960 and TRF7960A Start-up Sequence System developers concerned about minimizing the current draw of TRF7960, TRF7960A, and their variants systems at start-up time need guidance about handling the Regulator Control register (0x0B) value. Valid application use case for this guidance is battery-powered RFID applications in which controlling the entire system current draw over time is of the utmost concern.
    TRF7960A RFID Multiplexer Example System This application report describes the 16-channel high-frequency (HF) (13.56 MHz) RFID reader system (based on the TRF7960A IC) designed by TI for customer use. The system firmware resides on an MSP430F2370 MCU and supports the ISO/IEC 15693 protocol in addition to communication with a host.
    Comparison of TRF7960 and TRF7960AThis application report helps current and new users of the TRF7960 high-frequency RFID/NFC reader understand the differences between the TRF7960 and the TRF7960A devices. Understanding these differences in detail and applying this knowledge to application-specific requirements helps designers make informed decisions about whether or not a bill of materials change is needed.

Related Links

Table 8-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 8-1 Related Links

TRF7960 Click here Click here Click here Click here Click here
TRF7961 Click here Click here Click here Click here Click here

Community Resources

The following link connects to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community

TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.


MSP430, Tag-it, E2E are trademarks of Texas Instruments.

FeliCa is a trademark of Sony Corporation.

Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.


    TI Glossary This glossary lists and explains terms, acronyms, and definitions.