SLLS808A JULY   2007  – November 2016 TRS202

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  Switching Characteristics: Driver
    9. 6.9  Switching Characteristics: Receiver
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS-232 Driver
      3. 8.3.3 RS-232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC Powered by 5 V
      2. 8.4.2 VCC Unpowered
      3. 8.4.3 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Capacitor Selection
      2. 9.1.2 Electrostatic Discharge (ESD) Protection
      3. 9.1.3 ESD Test Conditions
      4. 9.1.4 Human-Body Model (HBM)
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Capacitor Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC(2) –0.3 6 V
Positive charge pump voltage, V+(2) VCC – 0.3 14 V
Negative charge pump voltage, V–(2) –14 0.3 V
Input voltage, VI Drivers –0.3 V+ + 0.3 V
Receivers ±30
Output voltage, VO Drivers V– – 0.3 V+ + 0.3 V
Receivers –0.3 VCC + 0.3
Short-circuit duration, DOUT Continuous
Operating virtual junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Pins 7, 8, 13,
14, and 15		 ±15000 V
All other pins ±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

see Figure 12(1)
MIN NOM MAX UNIT
Supply voltage 4.5 5 5.5 V
VIH Driver high-level input voltage (DIN) 2 V
VIL Driver low-level input voltage (DIN) 0.8 V
VI Driver input voltage (DIN) 0 5.5 V
Receiver input voltage (RIN) –30 30
TA Operating free-air temperature TRS202C 0 70 °C
TRS202I –40 85
(1) Test conditions are C1 to C4 = 0.1 µF at VCC = 5 V ±0.5 V.

6.4 Thermal Information

THERMAL METRIC(1) TRS202 UNIT
D (SOIC) PW (TSSOP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 76.2 101 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.8 36.4 °C/W
RθJB Junction-to-board thermal resistance 33.9 45.9 °C/W
ψJT Junction-to-top characterization parameter 6.7 2.7 °C/W
ψJB Junction-to-board characterization parameter 33.6 45.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted; see Figure 12)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
ICC Supply current No load and VCC = 5 V 8 15 mA
(1) Test conditions are C1 to C4 = 0.1 µF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.

6.6 Electrical Characteristics: Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted; see Figure 12)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage DOUT at RL = 3 kΩ to GND and DIN = GND 5 9 V
VOL Low-level output voltage DOUT at RL = 3 kΩ to GND and DIN = VCC –5 –9 V
IIH High-level input current VI = VCC 15 200 µA
IIL Low-level input current VI at 0 V –15 –200 µA
IOS(3) Short-circuit output current VCC = 5.5 V and VO = 0 V ±10 ±60 mA
ro Output resistance VCC, V+, V– = 0 V, and VO = ±2 V 300 Ω
(1) Test conditions are C1 to C4 = 0.1 µF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.
(3) Short-circuit durations must be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output must be shorted at a time.

6.7 Electrical Characteristics: Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted; see Figure 12)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage IOH = –1 mA 3.5 VCC – 0.4 V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VIT+ Positive-going input threshold voltage VCC = 5 V and TA = 25°C 1.7 2.4 V
VIT– Negative-going input threshold voltage VCC = 5 V and TA = 25°C 0.8 1.2 V
Vhys Input hysteresis (VIT+ – VIT–) 0.2 0.5 1 V
rI Input resistance VI = ±3 V to ±25 V 3 5 7 kΩ
(1) Test conditions are C1 to C4 = 0.1 µF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.

6.8 Switching Characteristics: Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted; see Figure 12)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
Maximum data rate CL = 50 to 1000 pF, one DOUT switching, and
RL = 3 kΩ to 7 kΩ (see Figure 6)		 120 kbit/s
tPLH(D) Propagation delay time,
low- to high-level output		 CL = 2500 pF, all drivers loaded, and RL = 3 kΩ
(see Figure 6)		 2 µs
tPHL(D) Propagation delay time,
high- to low-level output		 CL = 2500 pF, all drivers loaded, and RL = 3 kΩ
(see Figure 6)		 2 µs
tsk(p) Pulse skew(3) CL = 150 pF to 2500 pF and RL = 3 kΩ to 7 kΩ
(see Figure 7)		 300 ns
SR(tr) Slew rate, transition region CL = 50 pF to 1000 pF, VCC = 5 V, and RL = 3 kΩ to 7 kΩ (see Figure 6) 3 6 30 V/µs
(1) Test conditions are C1 to C4 = 0.1 µF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.

6.9 Switching Characteristics: Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted; see Figure 8)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
tPLH(R) Propagation delay time, low- to high-level output CL = 150 pF 0.5 10 µs
tPHL(R) Propagation delay time, high- to low-level output CL = 150 pF 0.5 10 µs
tsk(p) Pulse skew(3) 300 ns
(1) Test conditions are C1 to C4 = 0.1 µF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.

6.10 Typical Characteristics

TA = 25°C (unless otherwise noted)
TRS202 D001_RX_VOL.gif Figure 1. Receiver VOL vs Output Current
TRS202 D003_TX_VOL.gif Figure 3. Driver VOL vs Output Current
TRS202 D005_LB_0NF.gif Figure 5. Driver and Receiver Loopback Waveforms
TRS202 D002_RX_VOH.gif Figure 2. Receiver VOH vs Output Current
TRS202 D004_TX_VOH.gif Figure 4. Driver VOH vs Output Current