SCDS300E July   2010  – June 2020 TS3USB221A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Dynamic Electrical Characteristics: VCC = 3.3 V
    7. 6.7  Dynamic Electrical Characteristics: VCC = 2.5 V
    8. 6.8  Switching Characteristics: VCC = 3.3 V
    9. 6.9  Switching Characteristics: VCC = 2.5 V
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Mode
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK Input-source clamp voltage VCC = 3.6 V, 2.7 V, II = –18 mA –1.8 V
IIN Input leakage current,
control inputs		 VCC = 3.6 V, 2.7 V, 0 V, VIN = 0 V to 3.6 V ±1 µA
IOZ(3) Off-state leakage current VCC = 3.6 V, 2.7 V, VO = 0 V to 5.25 V, VI = 0 V, VIN = VCC or GND, Switch OFF ±1 µA
I(OFF) Power-off leakage current VCC = 0 V VI/O = 0 V to 5.25 V ±2 µA
VI/O = 0 V to 3.6 V ±2
VI/O = 0 V to 2.7 V ±1
ICC Supply current VCC = 3.6 V, 2.7 V, VIN = VCC or GND, II/O = 0 V, Switch ON or OFF 30 µA
ICC Supply current (low power mode) VCC = 3.6 V, 2.7 V, VIN = VCC or GND, Switch disabled, OE in high state 1 µA
ΔICC(4) Supply-current change, control inputs One input at 1.8 V,
Other inputs at VCC or GND		 VCC = 3.6 V 20 µA
VCC = 2.7 V 0.5
Cin Input capacitance, control inputs VCC = 3.3 V, 2.5 V, VIN = VCC or 0 V 1.5 2.5 pF
Cio(OFF) OFF capacitance VCC = 3.3 V, 2.5 V, VI/O = VCC or 0 V, Switch OFF 3.5 5 pF
Cio(ON) ON capacitance VCC = 3.3 V, 2.5 V, VI/O = VCC or 0 V, Switch ON 6 7.5 pF
RON(5) ON-state resistance VCC = 3 V, 2.3 V VI = 0 V, IO = 30 mA TA = 25°C 3 6 Ω
VI = 2.4 V, IO = –15 mA 3.4 6
VI = 0 V, IO = 30 mA TA = 125°C 6 10
VI = 2.4 V, IO = –15 mA 10 16
ΔRON ON-state resistance match between channels VCC = 3 V, 2.3 V VI = 0 V, IO = 30 mA 0.2 Ω
VI = 1.7, IO = –15 mA 0.2
rON(flat) ON-state resistance flatness VCC = 3 V, 2.3 V VI = 0 V, IO = 30 mA 1 Ω
VI = 1.7, IO = –15 mA 1
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.