SCDS300D July   2010  – August 2016 TS3USB221A-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Dynamic Electrical Characteristics: VCC = 3.3 V
    7. 6.7  Dynamic Electrical Characteristics: VCC = 2.5 V
    8. 6.8  Switching Characteristics: VCC = 3.3 V
    9. 6.9  Switching Characteristics: VCC = 2.5 V
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Mode
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VIN Control input voltage(2) (3) –0.5 7 V
VI/O Switch I/O voltage(2) (3) (4) –0.5 7 V
IIK Control input clamp current VIN < 0 –50 mA
II/OK I/O port clamp current VI/O < 0 –50 mA
II/O ON-state switch current(5) ±120 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O.
(5) II and IO are used to denote specific conditions for II/O.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002 Classification Level H2(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 Classification C5 ±2000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VIH High-level control input voltage VCC = 2.3 V to 2.7 V 0.46 × VCC V
VCC = 2.7 V to 3.6 V 0.46 × VCC
VIL Low-level control input voltage VCC = 2.3 V to 2.7 V 0.25 × VCC V
VCC = 2.7 V to 3.6 V 0.25 × VCC
VI/O Data input/output voltage 0 5.5 V
TA Operating free-air temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TS3USB221A-Q1 UNIT
RSE (UQFN)
10 PINS
RθJA Junction-to-ambient thermal resistance 179.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 107.9 °C/W
RθJB Junction-to-board thermal resistance 100.7 °C/W
ψJT Junction-to-top characterization parameter 7.1 °C/W
ψJB Junction-to-board characterization parameter 100 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK Input-source clamp voltage VCC = 3.6 V, 2.7 V, II = –18 mA –1.8 V
IIN Input leakage current,
control inputs
VCC = 3.6 V, 2.7 V, 0 V, VIN = 0 V to 3.6 V ±1 µA
IOZ (3) Off-state leakage current VCC = 3.6 V, 2.7 V, VO = 0 V to 5.25 V, VI = 0 V, VIN = VCC or GND, Switch OFF ±1 µA
I(OFF) Power-off leakage current VCC = 0 V VI/O = 0 V to 5.25 V ±2 µA
VI/O = 0 V to 3.6 V ±2
VI/O = 0 V to 2.7 V ±1
ICC Supply current VCC = 3.6 V, 2.7 V, VIN = VCC or GND, II/O = 0 V, Switch ON or OFF 30 µA
ICC Supply current (low power mode) VCC = 3.6 V, 2.7 V, VIN = VCC or GND, Switch disabled, OE in high state 1 µA
ΔICC (4) Supply-current change, control inputs One input at 1.8 V,
Other inputs at VCC or GND
VCC = 3.6 V 20 µA
VCC = 2.7 V 0.5
Cin Input capacitance, control inputs VCC = 3.3 V, 2.5 V, VIN = VCC or 0 V 1.5 2.5 pF
Cio(OFF) OFF capacitance VCC = 3.3 V, 2.5 V, VI/O = VCC or 0 V, Switch OFF 3.5 5 pF
Cio(ON) ON capacitance VCC = 3.3 V, 2.5 V, VI/O = VCC or 0 V, Switch ON 6 7.5 pF
RON (5) ON-state resistance VCC = 3 V, 2.3 V VI = 0 V, IO = 30 mA TA = 25°C 3 6 Ω
VI = 2.4 V, IO = –15 mA 3.4 6
VI = 0 V, IO = 30 mA TA = 125°C 6 10
VI = 2.4 V, IO = –15 mA 10 16
ΔRON ON-state resistance match between channels VCC = 3 V, 2.3 V VI = 0 V, IO = 30 mA 0.2 Ω
VI = 1.7, IO = –15 mA 0.2
rON(flat) ON-state resistance flatness VCC = 3 V, 2.3 V VI = 0 V, IO = 30 mA 1 Ω
VI = 1.7, IO = –15 mA 1
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.

6.6 Dynamic Electrical Characteristics: VCC = 3.3 V

over operating range, TA = –40°C to 125°C, VCC = 3.3 V ±10%, GND = 0 V
PARAMETER TEST CONDITIONS TYP UNIT
XTALK Crosstalk RL = 50 , f = 250 MHz –40 dB
OIRR OFF isolation RL = 50 , f = 250 MHz –41 dB
BW Bandwidth (–3 dB) RL = 50 0.9 GHz

6.7 Dynamic Electrical Characteristics: VCC = 2.5 V

over operating range, TA = –40°C to 125°C, VCC = 2.5 V ±10%, GND = 0 V
PARAMETER TEST CONDITIONS TYP UNIT
XTALK Crosstalk RL = 50 , f = 250 MHz –39 dB
OIRR OFF isolation RL = 50 , f = 250 MHz –40 dB
BW Bandwidth (3 dB) RL = 50 0.9 GHz

6.8 Switching Characteristics: VCC = 3.3 V

over operating range, TA = –40°C to 125°C, VCC = 3.3 V ±10%, GND = 0 V
PARAMETER MIN TYP(1) MAX UNIT
tpd Propagation delay(2) (3) 0.25 ns
tON Line enable time S to D, nD 30 ns
OE to D, nD 17
tOFF Line disable time S to D, nD 12 ns
OE to D, nD 10
tSK(O) Output skew between center port to any other port(2) 0.1 0.2 ns
tSK(P) Skew between opposite transitions of the same output (tPHL– tPLH)(2) 0.1 0.2 ns
(1) For Max or Min conditions, use the appropriate value specified under Dynamic Electrical Characteristics: VCC = 3.3 V for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise and fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

6.9 Switching Characteristics: VCC = 2.5 V

over operating range, TA = –40°C to 125°C, VCC = 2.5 V ±10%, GND = 0 V
PARAMETER MIN TYP(1) MAX UNIT
tpd Propagation delay(2) (3) 0.25 ns
tON Line enable time S to D, nD 50 ns
OE to D, nD 32
tOFF Line disable time S to D, nD 23 ns
OE to D, nD 12
tSK(O) Output skew between center port to any other port(2) 0.1 0.2 ns
tSK(P) Skew between opposite transitions of the same output (tPHL– tPLH)(2) 0.1 0.2 ns
(1) For Max or Min conditions, use the appropriate value specified under Dynamic Electrical Characteristics: VCC = 2.5 V for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

6.10 Typical Characteristics

TS3USB221A-Q1 gain_cds277.gif
Figure 1. Gain vs Frequency
TS3USB221A-Q1 crosstalk_cds277.gif
Figure 3. Crosstalk vs Frequency
TS3USB221A-Q1 ron30ma_cds277.gif
Figure 5. rON vs VIN (IOUT = 30 mA)
TS3USB221A-Q1 offisolation_cds277.gif
Figure 2. OFF Isolation vs Frequency
TS3USB221A-Q1 ron15ma_cds277.gif
Figure 4. ron vs VIN (IOUT = –15 mA)