SLVSH43C July 2023 – May 2025 TSD03 , TSD05 , TSD12 , TSD15 , TSD18 , TSD24 , TSD36
PRODUCTION DATA
- 1
- 1Features
- 2Applications
- 3Description
- 4Pin Configuration and Functions
-
5Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings - JEDEC Specification
- 5.3 ESD Ratings - IEC Specification
- 5.4 Recommended Operating Conditions
- 5.5 Thermal Information
- 5.6 Electrical Characteristics - TSD03
- 5.7 Electrical Characteristics - TSD05
- 5.8 Electrical Characteristics - TSD12
- 5.9 Electrical Characteristics - TSD15
- 5.10 Electrical Characteristics - TSD18
- 5.11 Electrical Characteristics - TSD24
- 5.12 Electrical Characteristics - TSD36
- 5.13 Typical Characteristics
- 6Application and Implementation
- 7Device and Documentation Support
- 8Revision History
- 9Mechanical, Packaging, and Orderable Information
Package Options
Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
- DYF|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information
5.13 Typical Characteristics
Figure 5-1 Positive TLP Curve - TSD03
Figure 5-3 Negative TLP Curve - TSD05
Figure 5-5 Positive TLP Curve - TSD15
Figure 5-7 Positive TLP Curve - TSD24
Figure 5-9 Capacitance vs Bias Voltage
Figure 5-11 Temperature vs Capacitance - TSD05
Figure 5-2 Positive TLP Curve - TSD05
Figure 5-4 Positive TLP Curve - TSD12Figure 5-6 Positive TLP Curve - TSD18
Figure 5-8 Positive TLP Curve - TSD36
Figure 5-10 Leakage Current vs Temperature