SBOSA18C may   2020  – june 2023 TSV911A-Q1 , TSV912A-Q1 , TSV914A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TSV911A-Q1
    5. 7.5 Thermal Information: TSV912A-Q1
    6. 7.6 Thermal Information: TSV914A-Q1
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Overload Recovery
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Input and ESD Protection
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TSV91xA-Q1 family, which includes single-, dual-, and quad-channel operational amplifiers (op amps), is specifically designed for general-purpose automotive applications. Featuring rail-to-rail input and output (RRIO) swings, wide bandwidth (8 MHz), and low offset voltage (0.3 mV, typical), this family is designed for a variety of applications that require a good balance between speed and power consumption. The op amps are unity-gain stable and feature an ultra-low input bias current, which enables the family to be used in applications with high-source impedance. The low input bias current allows the devices to be used for sensor interfaces, and active filtering.

The robust design of the TSV91xA-Q1 provides ease-of-use to the circuit designer. Features include a unity-gain stable, integrated RFI-EMI rejection filter, no phase reversal in overdrive condition, and high electrostatic discharge (ESD) protection (4-kV HBM).

Device Information
PART NUMBER(1) CHANNEL COUNT(2) PACKAGE(1) PACKAGE SIZE(3)
TSV911A-Q1 Single DBV (SOT-23, 5) 2.90 mm × 2.80 mm
DCK (SC70, 5) 2.0 mm × 2.20 mm
TSV912A-Q1 Dual D (SOIC, 8) 4.90 mm × 6.00 mm
DGK (VSSOP, 8) 3.00 mm × 4.90 mm
PW (TSSOP, 8) 3.00 mm × 6.40 mm
TSV914A-Q1 Quad D (SOIC, 14) 8.65 mm × 6.00 mm
PW (TSSOP, 14) 5.00 mm × 6.40 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) See the Device Comparison table
(3) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-C55854F5-DFFB-4C88-AF42-92A864082B6F-low.gifLow-Side Motor Control
GUID-2C1286D8-1EE2-4EBB-A773-DC7E8018F18F-low.pngSmall-Signal Overshoot vs Load Capacitance