SLLSEV9E July   2016  – November 2023 TUSB522P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, Power Supply
    6. 6.6 Electrical Characteristics, DC
    7. 6.7 Electrical Characteristics, AC
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Equalization
      2. 7.3.2 De-Emphasis Control and Output Swing
      3. 7.3.3 Automatic LFPS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration
      2. 7.4.2 Power Modes
        1. 7.4.2.1 U0 Mode (Active Power Mode)
        2. 7.4.2.2 U2/U3 (Low Power Mode)
        3. 7.4.2.3 Disconnect Mode - RX Detect
        4. 7.4.2.4 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

For this design example, use the parameters provided in Table 8-1.

Table 8-1 Design Parameters
PARAMETER VALUE
Pre-channel A to B PCB trace length(1), LAB. 1 inches ≤ LAB ≤ 20 inches
Post-channel C to D PCB trace length(1), LCD. ≤ 6 inches
Minimum distance of the AC capacitors from TUSB522P, LAC-CAP 0.25 inches
Maximum distance of ESD component from the USB receptacle, LESD 0.6 inches
Maximum distance of series resistor (RESD) from ESD component, LR_ESD. 0.25 inches
CAC-USB1 AC-coupling capacitor (75 nF to 265 nF) 100 nF
CAC-USB2 AC-coupling capacitor (297 nF to 363 nF) Options:
  • RX1 or RX2 are DC-coupled to USB receptacle
  • 330 nF AC-couple with RRX resistor
Optional RRX resistor (220-kΩ ± 5%) Not used
Optional RESD (0-Ω to 2.2-Ω) Not used
VCC supply (3-V to 3.6-V) 3.3-V
EQ1 for RX1P/N (3, 6, or 9dB) 9 dB (EQ1 = High)
De-Emphasis 2 for TX2P/N (0, -3.5, and - 6.2 dB) -6.2 dB (OS2 = Low, DE2 = High)
EQ2 for RX2P/N (3, 6, or 9 dB) 6 dB (EQ2 = Floating)
De-Emphasis 1 for TX1P/N (0, -3.5, and -6.2 dB) -3.5 dB (OS1 = Low, DE1 = Floating)
Output Swing 1 (0.9 or 1.1 Vppd) 900 mV (OS1 = Low)
Output Swing 2 (0.9 or 1.1 Vppd) 900 mV (OS2 = Low)
(1) Maximum trace length assumes an insertion loss of 0.2 dB/inch/GHz. If insertion loss is more than 0.2 dB/inch/GHz, then maximum trace length must be reduced accordingly.