SCES641D MAY   2007  – October 2017 TXB0102

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: TA = 25°C
    6. 6.6  Electrical Characteristics: TA = -40°C to +85°C
    7. 6.7  Operating Characteristics
    8. 6.8  VCCA = 1.2 V Timing Requirements
    9. 6.9  VCCA = 1.5 V ± 0.1 V Timing Requirements
    10. 6.10 VCCA = 1.8 V ± 0.15 V Timing Requirements
    11. 6.11 VCCA = 2.5 V ± 0.2 V Timing Requirements
    12. 6.12 VCCA = 3.3 V ± 0.3 V Timing Requirements
    13. 6.13 VCCA = 1.2 V Switching Characteristics
    14. 6.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics
    15. 6.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics
    16. 6.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics
    17. 6.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Available in the Texas Instruments NanoFree™ Packages
  • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On
    B Port (VCCA ≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 4-µA Max ICC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2500-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)

Applications

  • Handsets
  • Smartphones
  • Tablets
  • Desktop PCs

Description

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA must not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TXB0102DCU VSSOP (8) 2.30 mm × 2.00 mm
TXB0102YZP DSBGA (8) 0.90 mm × 1.80 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Typical Operating Circuit

TXB0102 keygraphic_sces641.gif