Product details

Technology Family TXB Applications MDIO Bits (#) 2 High input voltage (Min) (Vih) 0.78 High input voltage (Max) (Vih) 5.5 Vout (Min) (V) 1.2 Vout (Max) (V) 5.5 IOH (Max) (mA) -0.02 IOL (Max) (mA) 0.02 Rating Catalog
Technology Family TXB Applications MDIO Bits (#) 2 High input voltage (Min) (Vih) 0.78 High input voltage (Max) (Vih) 5.5 Vout (Min) (V) 1.2 Vout (Max) (V) 5.5 IOH (Max) (mA) -0.02 IOL (Max) (mA) 0.02 Rating Catalog
DSBGA (YZP) 8 3 mm² .928 x 1.928 VSSOP (DCU) 8 6 mm² 2 x 3.1
  • Available in the Texas Instruments NanoFree™ Packages
  • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On
    B Port (VCCA ≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 4-µA Max ICC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2500-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Packages
  • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On
    B Port (VCCA ≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 4-µA Max ICC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2500-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA must not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA must not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

Download

Similar products you might be interested in

open-in-new Compare products
Pin-for-pin with same functionality to the compared device.
NEW TXU0102 ACTIVE Two channel fixed-direction level shifter with channels in same direction

2 channel fixed direction level translator

NEW TXU0202 ACTIVE Two channel fixed-direction level shifter with channels in opposite direction

2 channel fixed direction level translator

Same functionality with different pin-out to the compared device.
TXB0104 ACTIVE 4-Bit Bidirectional Voltage-Level Shifter with Auto Direction Sensing and +/-15 kV ESD Protect Same function for 4-channel voltage translator
TXB0108 ACTIVE 8-Bit Bidirectional Voltage-Level Shifter with Auto Direction Sensing and +/-15-kV ESD Protect Same function in 8-channel version

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 8
Type Title Date
* Data sheet TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and ±15-kV ESD Protection datasheet (Rev. D) PDF | HTML 17 Oct 2017
EVM User's guide TXB-EVM Evaluation Module User's Guide (Rev. A) PDF | HTML 02 Aug 2021
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
Application note Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) 28 Mar 2018
Application note Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices 19 Nov 2017
Application note Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators 30 Oct 2017
Application note A Guide to Voltage Translation With TXS-Type Translators 29 Jun 2010
Application note A Guide to Voltage Translation With TXB-Type Translators 03 Mar 2010

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic EVM supporting 5 through 8 pin DCK, DCT, DCU, DRL, and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Evaluation board

TXB-EVM — 1 to 8 bit TXB translator family evaluation module

This EVM is designed to support the TXB auto bidirectional families for single, dual, four and eight channel devices. The TXB devices belong to the auto bidirectional translation family with an operating voltage designed to level translation between 1.2V and 5.5 V.
User guide: PDF | HTML
Not available on TI.com
Simulation model

TXB0102 IBIS Model (Rev. A)

SCEM563A.ZIP (71 KB) - IBIS Model
Reference designs

TIDM-RF430FRLSENSE — RF430FRL152H NFC Temperature and Light Sensor Reference Design

This reference design provides a platform to evaluate the RF430FRL152H NFC Sensor Interface Transponder.  Directly out of the box, thermistor and photo transistor measurements can be communicated to an NFC enabled smart phone or other NFC/RFID Reader device.  This reference design can be (...)
Schematic: PDF
Reference designs

TIDA-00403 — Ultrasonic Distance Measurement using the TLV320AIC3268 miniDSP CODEC Reference Design

The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed (...)
Design guide: PDF
Schematic: PDF
Package Pins Download
DSBGA (YZP) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos