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Product details

Parameters

Technology Family TXB Application MDIO Bits (#) 2 High input voltage (Min) (Vih) 0.78 High input voltage (Max) (Vih) 5.5 Output voltage (Max) (V) 5.5 Output voltage (Min) (V) 1.2 IOH (Max) (mA) -0.02 IOL (Max) (mA) 0.02 Rating Catalog open-in-new Find other Auto bidirectional voltage translators

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Auto bidirectional voltage translators

Features

  • Available in the Texas Instruments NanoFree™ Packages
  • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On
    B Port (VCCA ≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 4-µA Max ICC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2500-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)

All trademarks are the property of their respective owners.

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Description

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA must not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

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Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
TXB0104 ACTIVE 4-Bit Bidirectional Voltage-Level Shifter with Auto Direction Sensing and +/-15 kV ESD Protect Same function for 4-channel voltage translator
TXB0108 ACTIVE 8-Bit Bidirectional Voltage-Level Shifter with Auto Direction Sensing and +/-15-kV ESD Protect Same function in 8-channel version

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 8
Type Title Date
* Datasheet TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and ±15-kV ESD Protection datasheet (Rev. D) Oct. 17, 2017
User guides TXB-EVM Evaluation Module Users Guide Oct. 08, 2019
Selection guides Voltage translation buying guide Jun. 13, 2019
Application notes Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) Mar. 28, 2018
Application notes Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices Nov. 19, 2017
Application notes Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators Oct. 30, 2017
Application notes A Guide to Voltage Translation With TXS-Type Translators Jun. 29, 2010
Application notes A Guide to Voltage Translation With TXB-Type Translators Mar. 03, 2010

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARDS Download
document-generic User guide
20
Description
This EVM is designed to support the TXB auto bidirectional families for single, dual, four and eight channel devices. The TXB devices belong to the auto bidirectional translation family with an operating voltage designed to level translation between 1.2V and 5.5 V.
Features
  • Supports the TXB0101, TXB0102, TXB0104, TXB0108
  • Supports DCK, DCU, RUT and RGY packages of TI
  • Option of individual external loading per channel
  • Additional package options supported on the same footprint
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODELS Download
SCEM563A.ZIP (71 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
RF430FRL152H NFC Temperature and Light Sensor Reference Design
TIDM-RF430FRLSENSE This reference design provides a platform to evaluate the RF430FRL152H NFC Sensor Interface Transponder.  Directly out of the box, thermistor and photo transistor measurements can be communicated to an NFC enabled smart phone or other NFC/RFID Reader device.  This reference design can be (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Ultrasonic Distance Measurement using the TLV320AIC3268 miniDSP CODEC Reference Design
TIDA-00403 The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

Support & training

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