SCES977B February   2025  – January 2026 TXG4041-Q1 , TXG4042-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Specifications
      1. 5.1.1  Absolute Maximum Ratings
      2. 5.1.2  ESD Ratings
      3. 5.1.3  Recommended Operating Conditions
      4. 5.1.4  Thermal Information
      5. 5.1.5  Electrical Characteristics
      6. 5.1.6  Supply Current
      7. 5.1.7  Switching Characteristics, VCCA = 1.8 ± 0.15V
      8. 5.1.8  Switching Characteristics, VCCA = 2.5 ± 0.2V
      9. 5.1.9  Switching Characteristics, VCCA = 3.3 ± 0.3V
      10. 5.1.10 Switching Characteristics, VCCA = 5.0 ± 0.5V
      11. 5.1.11 Switching Characteristics: Tsk, TMAX
    2. 5.2 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 7.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 7.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3 VCC Disconnect
      4. 7.3.4 Over-Voltage Tolerant Inputs
      5. 7.3.5 Glitch-Free Power Supply Sequencing
      6. 7.3.6 Negative Clamping Diodes
      7. 7.3.7 Fully Configurable Dual-Rail Design
      8. 7.3.8 Supports High-Speed Translation
      9. 7.3.9 AC Noise Rejection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYY|14
  • RUC|14
  • DBQ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.