SLVS010W january   1976  – april 2023 UA78L

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: UA78L02 (for legacy chip only)
    6. 6.6  Electrical Characteristics: UA78L033 (for new chip only)
    7. 6.7  Electrical Characteristics: UA78L05 (for both legacy and new chip)
    8. 6.8  Electrical Characteristics: UA78L12 (for both legacy and new chip)
    9. 6.9  Electrical Characteristics: UA78L06 (for legacy chip only)
    10. 6.10 Electrical Characteristics: UA78L08 (for legacy chip only)
    11. 6.11 Electrical Characteristics: UA78L09 (for legacy chip only)
    12. 6.12 Electrical Characteristics: UA78L10 (for legacy chip only)
    13. 6.13 Electrical Characteristics: UA78L15 (for both legacy and new chip)
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Dropout Voltage (VDO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Power Dissipation (PD)
        3. 8.2.2.3 Estimating Junction Temperature
        4. 8.2.2.4 External Capacitor Requirements
        5. 8.2.2.5 Overload Recovery
        6. 8.2.2.6 Reverse Current
        7. 8.2.2.7 Polarity Reversal Protection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Positive Regulator in Negative Configuration
      2. 8.3.2 Current Limiter Circuit
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
      2. 9.1.2 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • PK|3
  • LP|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Input voltage range (VI):
    • 4.75 V to 35 V (for legacy chip)
    • 4.75 V to 45 V (for new chip)
  • Output voltage range (VO):
    • 2.6 V to 15 V (for legacy chip)
    • 3.3 V to 15 V (for new chip)
  • Output current: Up to 100 mA
  • Quiescent current IQ: 3.8 mA
  • Built-in short-circuit current limiting and thermal protection
  • Stable without any external component
  • Supported temperature range:
    • Legacy chip C and AC versions: 0°C to +125°C
    • Legacy chip AI version: –40°C to +125°C
    • New chip: –40°C to +125°C
  • Packages:
    • 8-pin, 4.9-mm × 3.91-mm SOIC
    • 3-pin, 4.3-mm × 4.3-mm TO-92
    • 3-pin, 4.5-mm × 2.5-mm SOT-89
  • M3-suffix devices are Advance Information devices