SLUSA13D February   2010  – September 2016 UCC27321-Q1 , UCC27322-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Stage
      2. 9.3.2 Output Stage
      3. 9.3.3 Source and Sink Capabilities During Miller Plateau
      4. 9.3.4 VDD
      5. 9.3.5 Drive Current and Power Requirements
      6. 9.3.6 Enable
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input-to-Output Configuration
        2. 10.2.2.2 Input Threshold Type
        3. 10.2.2.3 VDD Bias Supply Voltage
        4. 10.2.2.4 Peak Source and Sink Currents
        5. 10.2.2.5 Enable and Disable Function
        6. 10.2.2.6 Propagation Delay
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
    4. 12.4 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • Industry-Standard Pinout With Addition of Enable Function
  • High Peak-Current Drive Capability of ±9 A at the Miller Plateau Region Using TrueDrive™ Technology
  • Efficient Constant-Current Sourcing Using a Unique Bipolar and CMOS Output Stage
  • TTL and CMOS-Compatible Inputs Independent of Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times With 10-nF Load
  • Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
  • 4-V to 15-V Supply Voltage
  • Available in Thermally Enhanced MSOP PowerPAD™ Package
  • TrueDrive Output Architecture Using Bipolar and CMOS Transistors in Parallel

2 Applications

  • Switch-Mode Power Supplies
  • DC-DC Converters
  • Motor Controllers
  • Line Drivers
  • Class-D Switching Amplifiers
  • Pulse Transformer Driver

3 Description

The UCC2732x-Q1 family of high-speed drivers delivers 9 A of peak drive current in an industry-standard pinout. These drivers can drive large MOSFETs for systems requiring extreme Miller current due to high dV/dt transitions. This eliminates additional external circuits and can replace multiple components to reduce space, design complexity, and assembly cost. Two standard logic options are offered, inverting (UCC27321-Q1) and noninverting (UCC27322-Q1).

Using a design that minimizes shoot-through current, the outputs of these devices can provide high gate drive current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique hybrid-output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages. With this drive architecture, UCC2732x-Q1 can be used in industry standard 6-A, 9-A, and many 12-A driver applications. Latch-up and ESD protection circuits are also included. Finally, the UCC2732x-Q1 provides an enable (ENBL) function to better control the operation of the driver applications. ENBL is implemented on pin 3, which was previously left unused in the industry-standard pinout. It is internally pulled up to VDD for active-high logic and can be left open for standard operation.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
UCC27321-Q1, UCC27322-Q1 SOIC (8) 6.00 mm × 4.90 mm
UCC27322-Q1 MSOP-PowerPAD (8) 4.90 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Functional Block Diagram

UCC27321-Q1 UCC27322-Q1 pg1_fbd_iotable_lusa13.gif