SGLS274H September   2008  – October 2016 UCC27423-Q1 , UCC27424-Q1 , UCC27425-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
      3. 8.3.3 Enable
      4. 8.3.4 Parallel Outputs
      5. 8.3.5 Operational Waveforms and Circuit Layout
      6. 8.3.6 VDD
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Source and Sink Capabilities During Miller Plateau
        2. 9.2.2.2 Drive Current and Power Requirements
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High-Current Drive Capability of ±4 A
  • Unique Bipolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
  • Inputs Independent of Supply Voltage Compatible With TTL and CMOS
  • 20-ns Typical Rise and 15-ns Typical Fall Times With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive Current
  • Available in Thermally Enhanced MSOP PowerPAD™ Package
  • Rated From –40°C to +125°C

2 Applications

  • Switch Mode Power Supplies
  • DC-DC Converters
  • Motor Controllers
  • Line Drivers
  • Class D Switching Amplifiers

3 Description

The UCC2742x-Q1 family of devices are high-speed dual MOSFET drivers capable of delivering large peak currents into capacitive loads. Two standard logic options are offered: dual inverting and dual noninverting drivers. They are offered in the standard 8-pin SOIC (D) package. The thermally enhanced 8-pin PowerPAD Package MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A current where it is needed most, at the Miller plateau region, during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x-Q1 provide enable (ENBL) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which were previously left unused in the industry standard pinout. They are internally pulled up to VDD for active-high logic and can be left open for standard operation.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
UCC2742x-Q1 SOIC (8) 4.90 mm × 3.91 mm
MSOP
With PowerPAD (8)
3.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Block Diagram

UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 fbd_gls274.gif