Product details

Number of channels (#) 2 Power switch MOSFET, IGBT Peak output current (A) 4 Input VCC (Min) (V) 4 Input VCC (Max) (V) 15 Features Enable Pin Operating temperature range (C) -40 to 125 Rise time (ns) 20 Fall time (ns) 15 Prop delay (ns) 25 Input threshold CMOS, TTL Channel input logic Inverting Input negative voltage (V) 0 Rating Automotive Driver configuration Dual inputs
Number of channels (#) 2 Power switch MOSFET, IGBT Peak output current (A) 4 Input VCC (Min) (V) 4 Input VCC (Max) (V) 15 Features Enable Pin Operating temperature range (C) -40 to 125 Rise time (ns) 20 Fall time (ns) 15 Prop delay (ns) 25 Input threshold CMOS, TTL Channel input logic Inverting Input negative voltage (V) 0 Rating Automotive Driver configuration Dual inputs
HVSSOP (DGN) 8 9 mm² 3 x 3 SOIC (D) 8 19 mm² 3.91 x 4.9
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High-Current Drive Capability of ±4 A
  • Unique Bipolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
  • Inputs Independent of Supply Voltage Compatible With TTL and CMOS
  • 20-ns Typical Rise and 15-ns Typical Fall Times With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive Current
  • Available in Thermally Enhanced MSOP PowerPAD Package
  • Rated From –40°C to +125°C

All trademarks are the property of their respective owners.

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High-Current Drive Capability of ±4 A
  • Unique Bipolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
  • Inputs Independent of Supply Voltage Compatible With TTL and CMOS
  • 20-ns Typical Rise and 15-ns Typical Fall Times With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive Current
  • Available in Thermally Enhanced MSOP PowerPAD Package
  • Rated From –40°C to +125°C

All trademarks are the property of their respective owners.

The UCC2742x-Q1 family of devices are high-speed dual MOSFET drivers capable of delivering large peak currents into capacitive loads. Two standard logic options are offered: dual inverting and dual noninverting drivers. They are offered in the standard 8-pin SOIC (D) package. The thermally enhanced 8-pin PowerPAD Package MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A current where it is needed most, at the Miller plateau region, during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x-Q1 provide enable (ENBL) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which were previously left unused in the industry standard pinout. They are internally pulled up to VDD for active-high logic and can be left open for standard operation.

For all available packages, see the orderable addendum at the end of the data sheet.

The UCC2742x-Q1 family of devices are high-speed dual MOSFET drivers capable of delivering large peak currents into capacitive loads. Two standard logic options are offered: dual inverting and dual noninverting drivers. They are offered in the standard 8-pin SOIC (D) package. The thermally enhanced 8-pin PowerPAD Package MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A current where it is needed most, at the Miller plateau region, during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x-Q1 provide enable (ENBL) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which were previously left unused in the industry standard pinout. They are internally pulled up to VDD for active-high logic and can be left open for standard operation.

For all available packages, see the orderable addendum at the end of the data sheet.

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Technical documentation

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Type Title Date
* Data sheet UCC2742x-Q1 Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable datasheet (Rev. H) PDF | HTML 04 Oct 2016
Technical article Managing power-supply noise with a 30-V gate driver 07 Dec 2021
Application note External Gate Resistor Selection Guide (Rev. A) 28 Feb 2020
Application note Understanding Peak IOH and IOL Currents (Rev. A) 28 Feb 2020
Application note Improving Efficiency of DC-DC Conversion through Layout 07 May 2019
More literature Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) 29 Oct 2018
Technical article How to achieve higher system robustness in DC drives, part 3: minimum input pulse 19 Sep 2018
Technical article How to achieve higher system robustness in DC drives, part 2: interlock and deadtime 30 May 2018
Technical article Boosting efficiency for your solar inverter designs 24 May 2018
EVM User's guide UCC27423-4-5-Q1 EVM User’s Guide (Rev. A) 16 Apr 2018

Design & development

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Simulation model

UCC27423 PSpice Transient Model

SLUM321.ZIP (44 KB) - PSpice Model
Simulation model

UCC27423 Unencrypted PSpice Transient Model

SLUM507.ZIP (2 KB) - PSpice Model
Calculation tool

UCC2742X Schematic Review Template

SLURB24.ZIP (110 KB)
Simulation tool

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PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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HVSSOP (DGN) 8 View options
SOIC (D) 8 View options

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