SLUS492J June   2001  – September 2018 UCC27323 , UCC27324 , UCC27325 , UCC37323 , UCC37324 , UCC37325

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Application Diagram
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Source/Sink Capabilities During Miller Plateau
        2. 9.2.2.2 Parallel Outputs
        3. 9.2.2.3 VDD
        4. 9.2.2.4 Driver Current and Power Requirements
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The UCC2732x and UCC3732x family of high-speed dual-MOSFET Drivers deliver 4-A source and 4-A sink peak current to effectively drive MOSFETs where it is needed most at the Miller Plateau Region. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages. Three standard logic options are offered — dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. Input thresholds are based on TTL and CMOS and independent of supply voltage and feature wide input hysteresis offering excellent noise immunity. The UCC2732x and UCC3732x family is available in the standard SOIC-8 (D) or PDIP-8 (P) packages as well as the thermally enhanced -8pin PowerPAD MSOP package (DGN), drastically lowering thermal resistance to improve long term reliability.

Device Information(1)

DEVICE KEY SPECS PACKAGE
UCCx732x -40C <= Temp <= 125C
4.5V <= VDD<= 15V
20ns/15ns - Rise/Fall times @ 1.8nF load
35ns/25ns Rise/Fall Prop Delay
SOIC (8): 4.90 mm × 3.91 mm
MSOP-PowerPAD (8): 3.00 mm × 3.00 mm
PDIP (8): 9.81 mm × 6.35 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.