The application firmware for the UCD3138x is developed on Texas Instruments Code Composer Studio (CCS) integrated development environment.
Device programming, real time debug and monitoring/configuration of key device parameters for certain power topologies are all available through Texas Instruments’ FUSION_DIGITAL_POWER_DESIGNER Graphical User Interface (http://www.ti.com/tool/fusion_digital_power_designer). The FUSION_DIGITAL_POWER_DESIGNER software application uses the PMBus protocol to communicate with the device over a serial bus using an interface adaptor known as the USB-TO-GPIO, available as an EVM from Texas Instruments (http://www.ti.com/tool/usb-to-gpio). PMBUS-based real-time debug capability is available through the ‘Memory Debugger’ tool within the Device GUI module of the FUSION_DIGITAL_POWER_DESIGNER GUI, which represents a powerful alternative over traditional JTAG-based approaches’.
The software application can also be used to program the devices, with a version of the tool known as FUSION_MFR_GUI optimized for manufacturing environments (http://www.ti.com/tool/fusion_mfr_gui). The FUSION_MFR_GUI tool supports multiple devices on a board, and includes built-in logging and reporting capabilities.
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
In terms of reference documentation, the following programmer’s manuals are available offering detailed information regarding the application and usage of UCD3138x digital controller:
In addition to the tools and documentation described above, for the most up to date information regarding evaluation modules, reference application firmware and application notes/design tips, please visit http://www.ti.com/product/UCD3138A64.
PMBus is a trademark of SMIF, Inc.
All other trademarks are the property of their respective owners.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.