SLUS652E March   2005  – April 2020 UCD8220

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 UCD8220 Typical Simplified Push-Pull Converter Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CLK Input Time-Domain Digital Pulse Train
      2. 7.3.2 Current Sensing and Protection
      3. 7.3.3 Handshaking
      4. 7.3.4 Driver Output
      5. 7.3.5 Source and Sink Capabilities During Miller Plateau
      6. 7.3.6 Drive Current and Power Requirements
      7. 7.3.7 Clearing the Current-Limit Flag (CLF)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting the ISET Resistor for Voltage Mode Control
        2. 8.2.2.2 Selecting the ISET Resistor for Voltage Mode Control with Voltage Feed Forward
        3. 8.2.2.3 Selecting the ISET Resistor for Peak Current Mode Control with Internal Slope Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Considerations

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the device package. In order for a power driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The UCD8220 device is available in the PowerPAD integrated circuit package, HTSSOP, to cover a range of application requirements. The package has an exposed pad to enhance thermal conductivity from the semiconductor junction.

As shown in (4) in the Related Documentation section, the PowerPAD integrated circuit packages offer a leadframe die pad that is exposed at the base of the package. This pad is soldered to the copper on the PC board (PCB) directly underneath the device package, reducing the RθJA down to 37.47°C/W. The PC board must be designed with thermal lands and thermal vias to complete the heat removal subsystem, as discussed in (3) in the Related Documentation section.

Note that the PowerPAD integrated circuit package is not directly connected to any leads of the package. However, the PowerPAD is electrically and thermally connected to the substrate which is the ground of the device. The PowerPAD integrated circuit package should be connected to the quiet ground of the circuit.