SLPS584B December   2015  – December 2017 CSD95377Q4M

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Powering CSD95377Q4M and Gate Drivers
      2. 7.3.2 Undervoltage Lockout (UVLO) Protection
      3. 7.3.3 PWM Pin
      4. 7.3.4 SKIP# Pin
        1. 7.3.4.1 Zero Crossing (ZX) Operation
      5. 7.3.5 Integrated Boost-Switch
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application Curves
    3. 8.3 System Example
      1. 8.3.1 Power Loss Curves
      2. 8.3.2 Safe Operating Area (SOA) Curves
      3. 8.3.3 Normalized Curves
      4. 8.3.4 Calculating Power Loss and SOA
        1. 8.3.4.1 Design Example
        2. 8.3.4.2 Calculating Power Loss
        3. 8.3.4.3 Calculating SOA Adjustments
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Recommended PCB Design Overview
      2. 9.1.2 Electrical Performance
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Drawing
    2. 11.2 Recommended PCB Land Pattern
    3. 11.3 Recommended Stencil Opening

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPC|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Above 94% System Efficiency at 15 A
  • Max Rated Continuous Current 35 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm × 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode With Forced Continuous Conduction Mode (FCCM)
  • Input Voltages to 16 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free

2 Applications

  • Point-of-Load Synchronous Buck in Server, Networking, Telecom Systems
  • Multiphase Vcore, DDR, and Graphics Solutions

3 Description

The CSD95377Q4M NexFET™ power stage is a highly-optimized design for use in a high power, high density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. The driver IC has built-in selectable diode emulation function enables Discontinuous Conduction Mode (DCM) operation to improve light load efficiency. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 3.5 mm × 4.5 mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

Device Information(1)

DEVICE MEDIA QTY PACKAGE SHIP
CSD95377Q4M 13-Inch Reel 2500 SON
3.50-mm × 4.50-mm
Plastic Package		 Tape and Reel
CSD95377Q4MT 7-Inch Reel 250
  1. For all available packages, see the orderable addendum at the end of the data sheet.

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Application Diagram

CSD95377Q4M Applications_Diagram2.gif

Typical Power Stage Efficiency and Power Loss

CSD95377Q4M D000_SLPS584.gif