DLPS201C August   2020  – September 2023 DLPC230S-Q1 , DLPC231S-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics for Fixed Voltage I/O
    7. 6.7  DMD High-Speed Sub-LVDS Electrical Characteristics
    8. 6.8  DMD Low-Speed Sub-LVDS Electrical Characteristics
    9. 6.9  OpenLDI LVDS Electrical Characteristics
    10. 6.10 Power Dissipation Characterisics
    11. 6.11 System Oscillators Timing Requirements
    12. 6.12 Power Supply and Reset Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 OpenLDI Interface General Timing Requirements
    15. 6.15 Parallel/OpenLDI Interface Frame Timing Requirements
    16. 6.16 Host/Diagnostic Port SPI Interface Timing Requirements
    17. 6.17 Host/Diagnostic Port I2C Interface Timing Requirements
    18. 6.18 Flash Interface Timing Requirements
    19. 6.19 TPS99000S-Q1 SPI Interface Timing Requirements
    20. 6.20 TPS99000S-Q1 AD3 Interface Timing Requirements
    21. 6.21 Master I2C Port Interface Timing Requirements
    22. 6.22 Chipset Component Usage Specification
  8. 7 Parameter Measurement Information
    1. 7.1 HOST_IRQ Usage Model
    2. 7.2 Input Source
      1. 7.2.1 Supported Input Sources
      2. 7.2.2 Parallel Interface Supported Data Transfer Formats
        1. 7.2.2.1 OpenLDI Interface Supported Data Transfer Formats
          1. 7.2.2.1.1 OpenLDI Interface Bit Mapping Modes
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Parallel Interface
      2. 8.3.2  OpenLDI Interface
      3. 8.3.3  DMD (Sub-LVDS) Interface
      4. 8.3.4  Serial Flash Interface
      5. 8.3.5  Serial Flash Programming
      6. 8.3.6  Host Command and Diagnostic Processor Interfaces
      7. 8.3.7  GPIO Supported Functionality
      8. 8.3.8  Built-In Self Test (BIST)
      9. 8.3.9  EEPROMs
      10. 8.3.10 Temperature Sensor
      11. 8.3.11 Debug Support
    4. 8.4 Device Functional Modes
      1. 8.4.1 Standby Mode
      2. 8.4.2 Display Mode
      3. 8.4.3 Calibration Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Head-Up Display
        1. 9.2.1.1 Design Requirements
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Management
    2. 10.2 Hot Plug Usage
    3. 10.3 Power Supply Filtering
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1  PCB Layout Guidelines for Internal ASIC PLL Power
      2. 11.1.2  DLPC23xS-Q1 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3  DMD Interface Layout Considerations
      4. 11.1.4  General PCB Recommendations
      5. 11.1.5  General Handling Guidelines for Unused CMOS-Type Pins
      6. 11.1.6  Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      7. 11.1.7  Number of Layer Changes
      8. 11.1.8  Stubs
      9. 11.1.9  Terminations
      10. 11.1.10 Routing Vias
    2. 11.2 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Nomenclature
        1. 12.1.2.1 Device Markings
        2. 12.1.2.2 Video Timing Parameter Definitions
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 DLPC230S-Q1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZDQ|324
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Data Sheet

DLPC23xS-Q1 Automotive Digital Micromirror Device Controller