SLVSH10C November   2022  – December 2022 ESD751 , ESD761

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics – ESD751
    8. 6.8 Typical Characteristics - ESD761
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IEC 61000-4-5 Surge Protection
      2. 7.3.2 I/O Capacitance
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • IEC 61000-4-2 level 4 ESD protection:
    • ±22-kV or ±15-kV contact discharge
    • ±22-kV or ±15-kV air-gap discharge
  • Robust surge protection:
    • IEC 61000-4-5 (8/20 µs): 2.8 A or 1.8 A
  • 24-V working voltage
  • Bidirectional ESD protection
  • Low clamping voltage protects downstream components
  • Temperature range: –55°C to +150°C
  • I/O capacitance = 1.6 pF or 1.1 pF (typical)
  • Offered in a standard leaded package and 0402 footprint package: SOD-523 (DYA) and X1SON (DPY)
  • Leaded packages used for automatic optical inspection (AOI)