JAJSQJ6 December   2023 ADS1114L , ADS1115L

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Analog Inputs
      3. 8.3.3 Full-Scale Range (FSR) and LSB Size
      4. 8.3.4 Voltage Reference
      5. 8.3.5 Oscillator
      6. 8.3.6 Output Data Rate and Conversion Time
      7. 8.3.7 Digital Comparator
      8. 8.3.8 Conversion-Ready Pin
      9. 8.3.9 SMBus Alert Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Reset and Power-Up
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Single-Shot Mode
        2. 8.4.2.2 Continuous-Conversion Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 I2C Address Selection
        2. 8.5.1.2 I2C Interface Speed
          1. 8.5.1.2.1 Serial Clock (SCL) and Serial Data (SDA)
        3. 8.5.1.3 I2C Data Transfer Protocol
        4. 8.5.1.4 Timeout
        5. 8.5.1.5 I2C General-Call (Software Reset)
      2. 8.5.2 Reading and Writing Register Data
        1. 8.5.2.1 Reading Conversion Data or the Configuration Register
        2. 8.5.2.2 Writing the Configuration Register
      3. 8.5.3 Data Format
  10. 9 Register Map
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Basic Connections
      2. 10.1.2 Unused Inputs and Outputs
      3. 10.1.3 Single-Ended Inputs
      4. 10.1.4 Input Protection
      5. 10.1.5 Analog Input Filtering
      6. 10.1.6 Connecting Multiple Devices
      7. 10.1.7 Duty Cycling For Low Power
      8. 10.1.8 I2C Communication Sequence Example
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Supply Sequencing
      2. 10.3.2 Power-Supply Decoupling
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.3.2 Power-Supply Decoupling

Good power-supply decoupling is important to achieve optimum performance. As shown in Figure 10-11, VDD must be decoupled with at least a 0.1-µF capacitor. The 0.1-μF bypass capacitor supplies the momentary bursts of extra current required from the supply when the device is converting. Place the bypass capacitor as close to the power-supply pin of the device as possible using low-impedance connections. Use multilayer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, do not use vias to connect capacitors to the device pins for better noise immunity. Using multiple vias in parallel lowers the overall inductance, and is beneficial for connections to ground planes.

GUID-20230714-SS0I-JTNF-2WPC-JZPBHVRFVNH5-low.svg Figure 10-11 ADS1115L Power-Supply Decoupling