SBAS558C December   2012  – December 2015 ADS42B49

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. ADS424x and ADS422x Family Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics: ADS42B49 (250 MSPS)
    6. 8.6  Electrical Characteristics: General
    7. 8.7  Digital Characteristics
    8. 8.8  Timing Requirements: LVDS and CMOS Modes
    9. 8.9  Serial Interface Timing Characteristics
    10. 8.10 Reset Timing (Only When Serial Interface is Used)
    11. 8.11 LVDS Timings at Lower Sampling Frequencies
    12. 8.12 CMOS Timings at Lower Sampling Frequencies
    13. 8.13 Typical Characteristics
      1. 8.13.1 ADS42B49
      2. 8.13.2 Contour
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Migrating from the ADS62P49 and ADS4249
      2. 10.3.2 Digital Functions
      3. 10.3.3 Gain for SFDR and SNR Trade-Off
      4. 10.3.4 Offset Correction
    4. 10.4 Device Functional Modes
      1. 10.4.1 Power-Down
        1. 10.4.1.1 Global Power-Down
        2. 10.4.1.2 Channel Standby
        3. 10.4.1.3 Input Clock Stop
      2. 10.4.2 Digital Output Information
        1. 10.4.2.1 Output Interface
        2. 10.4.2.2 DDR LVDS Outputs
        3. 10.4.2.3 LVDS Buffer
        4. 10.4.2.4 Parallel CMOS Interface
        5. 10.4.2.5 CMOS Interface Power Dissipation
        6. 10.4.2.6 Multiplexed Mode of Operation
        7. 10.4.2.7 Output Data Format
      3. 10.4.3 Parallel Configuration Details
    5. 10.5 Programming
      1. 10.5.1 Parallel Configuration Only
      2. 10.5.2 Serial Interface Configuration Only
      3. 10.5.3 Using Both Serial Interface and Parallel Controls
      4. 10.5.4 Serial Interface Details
        1. 10.5.4.1 Register Initialization
        2. 10.5.4.2 Serial Register Readout
    6. 10.6 Register Maps
      1. 10.6.1 Register Description
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Driving Circuit
        1. 11.1.1.1 Drive Circuit Requirements
      2. 11.1.2 Clock Input
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Analog Input
        2. 11.2.2.2 Clock Driver
        3. 11.2.2.3 Digital Interface
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
    1. 12.1 Using DC/DC Power Supplies
    2. 12.2 Power Supply Bypassing
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Grounding
      2. 13.1.2 Supply Decoupling
      3. 13.1.3 Exposed Pad
      4. 13.1.4 Routing Analog Inputs
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Device Nomenclature
    2. 14.2 Documentation Support
      1. 14.2.1 Related Documentation
    3. 14.3 Community Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
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発注情報

15 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.