JAJSBH7C June   2011  – October 2016

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics - AC SPI Data Interface
    7. 6.7 Vertical Communications Bus
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog-to-Digital Conversion (ADC)
        1. 7.3.1.1  General Features
        2. 7.3.1.2  3-to-6 Series Cell Configuration
        3. 7.3.1.3  Cell Voltage Measurements
        4. 7.3.1.4  GPAI or VBAT Measurements
          1. 7.3.1.4.1 Converting GPAI Result to Voltage
          2. 7.3.1.4.2 Converting VBAT Result to Voltage
        5. 7.3.1.5  Temperature Measurement
          1. 7.3.1.5.1 External Temperature Sensor Support (TS1+, TS1-, TS2+, and TS2-)
          2. 7.3.1.5.2 Converting TSn Result to Voltage (Ratio)
        6. 7.3.1.6  ADC Band-Gap Voltage Reference
        7. 7.3.1.7  Conversion Control
          1. 7.3.1.7.1 Convert Start
            1. 7.3.1.7.1.1 Hardware Start
            2. 7.3.1.7.1.2 Firmware Start
          2. 7.3.1.7.2 Data Ready
          3. 7.3.1.7.3 ADC Channel Selection
          4. 7.3.1.7.4 Conversion Time Control
          5. 7.3.1.7.5 Automatic Versus Manual Control
        8. 7.3.1.8  Secondary Protection
          1. 7.3.1.8.1 Protector Functionality
            1. 7.3.1.8.1.1 Using the Protector Functions With 3-5 Cells
        9. 7.3.1.9  Cell Overvoltage Fault Detection (COV)
        10. 7.3.1.10 Cell Undervoltage Fault Detection (CUV)
        11. 7.3.1.11 Overtemperature Detection
          1. 7.3.1.11.1 Ratiometric Sensing
          2. 7.3.1.11.2 Thermistor Power
          3. 7.3.1.11.3 Thermistor Input Conditioning
        12. 7.3.1.12 Fault and Alert Behavior
          1. 7.3.1.12.1 Fault Recovery Procedure
        13. 7.3.1.13 Secondary Protector Built-In Self-Test Features
      2. 7.3.2 Cell Balancing
        1. 7.3.2.1 Cell Balance Control Safety Timer
      3. 7.3.3 Other Features and Functions
        1. 7.3.3.1 Internal Voltage Regulators
          1. 7.3.3.1.1 Internal 5-V Analog Supply
          2. 7.3.3.1.2 Internal 5-V Digital Supply
          3. 7.3.3.1.3 Low-Dropout Regulator (REG50)
          4. 7.3.3.1.4 Auxiliary Power Output (AUX)
        2. 7.3.3.2 Undervoltage Lockout and Power-On Reset
          1. 7.3.3.2.1 UVLO
          2. 7.3.3.2.2 Power-On Reset (POR)
          3. 7.3.3.2.3 Reset Command
        3. 7.3.3.3 Thermal Shutdown (TSD)
        4. 7.3.3.4 GPIO
      4. 7.3.4 Communications
        1. 7.3.4.1 SPI Communications - Device to Host
      5. 7.3.5 Device-to-Device Vertical Bus (VBUS) Interface
      6. 7.3.6 Packet Formats
        1. 7.3.6.1 Data Read Packet
        2. 7.3.6.2 Data Write Packet
        3. 7.3.6.3 Broadcast Writes
        4. 7.3.6.4 Communications Packet Structure
        5. 7.3.6.5 CRC Algorithm
        6. 7.3.6.6 Data Packet Usage Examples
      7. 7.3.7 Device Addressing
      8. 7.3.8 Changes and Enhancements for bq76PL536A
    4. 7.4 Device Functional Modes
      1. 7.4.1 SLEEP Functionality
        1. 7.4.1.1 SLEEP State Entry (Bit Set)
        2. 7.4.1.2 Sleep State Exit (Bit Reset)
    5. 7.5 Programming
      1. 7.5.1 Programming the EPROM Configuration Registers
    6. 7.6 Register Maps
      1. 7.6.1  I/O Register Details
      2. 7.6.2  Register Types
        1. 7.6.2.1 Read-Only (Group 1)
        2. 7.6.2.2 Read / Write (Group 2)
        3. 7.6.2.3 Read / Write, Initialized From EPROM (Group3)
        4. 7.6.2.4 Error Checking and Correcting (ECC) EPROM
      3. 7.6.3  Register Details
        1. 7.6.3.1 DEVICE_STATUS Register (0x00)
      4. 7.6.4  GPAI (0x01, 0x02) Register
      5. 7.6.5  VCELLn Register (0x03…0x0e)
      6. 7.6.6  TEMPERATURE1 Register (0x0f, 0x10)
      7. 7.6.7  TEMPERATURE2 Register (0x11, 0x12)
      8. 7.6.8  ALERT_STATUS Register (0x20)
      9. 7.6.9  FAULT_STATUS Register (0x21)
      10. 7.6.10 COV_FAULT Register (0x22)
      11. 7.6.11 CUV_FAULT Register (0x23)
      12. 7.6.12 PARITY_H Register (0x24) (PRESULT_A (R/O))
      13. 7.6.13 PARITY_H Register (0x25) (PRESULT_B (R/O))
      14. 7.6.14 ADC_CONTROL Register (0x30)
      15. 7.6.15 IO_CONTROL Register (0x31)
      16. 7.6.16 CB_CTRL Register (0x32)
      17. 7.6.17 CB_TIME Register (0x33)
      18. 7.6.18 ADC_CONVERT Register (0x34)
      19. 7.6.19 SHDW_CTRL Register (0x3a)
      20. 7.6.20 ADDRESS_CONTROL Register (0x3b)
      21. 7.6.21 RESET Register (0x3c)
      22. 7.6.22 TEST_SELECT Register (0x3d)
      23. 7.6.23 E_EN Register (0x3f)
      24. 7.6.24 FUNCTION_CONFIG Register (0x40)
      25. 7.6.25 IO_CONFIG Register (0x41)
      26. 7.6.26 CONFIG_COV Register (0x42)
      27. 7.6.27 CONFIG_COVT Register (0x43)
      28. 7.6.28 CONFIG_UV Register (0x44)
      29. 7.6.29 CONFIG_CUVT Register (0x45)
      30. 7.6.30 CONFIG_OT Register (0x46)
      31. 7.6.31 CONFIG_OTT Register (0x47)
      32. 7.6.32 USERx Register (0x48-0x4b) (USER1-4)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Anti-Aliasing Filter
      2. 8.1.2 Host SPI Interface Pin States
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Other Schematics
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 コミュニティ・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 デバイスおよびドキュメントのサポート

11.1 ドキュメントの更新通知を受け取る方法

ドキュメントの更新についての通知を受け取るには、ti.comのデバイス製品フォルダを開いてください。右上の隅にある「通知を受け取る」をクリックして登録すると、変更されたすべての製品情報に関するダイジェストを毎週受け取れます。変更の詳細については、修正されたドキュメントに含まれている改訂履歴をご覧ください。

11.2 コミュニティ・リソース

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 商標

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 静電気放電に関する注意事項

esds-image

これらのデバイスは、限定的なESD（静電破壊）保護機能を内 蔵しています。保存時または取り扱い時は、MOSゲートに対す る静電破壊を防止するために、リード線同士をショートさせて おくか、デバイスを導電フォームに入れる必要があります。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.