JAJSRN7C August   2009  – October 2023 CSD16322Q5

PRODUCTION DATA  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Revision History
  6. 5Electrical Characteristics
  7. 6Thermal Characteristics
  8. 7Typical MOSFET Characteristics
  9. 8Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Thermal Characteristics

(TA = 25°C unless otherwise stated)
PARAMETER MIN TYP MAX UNIT
RθJC Thermal Resistance Junction to Case(1) 2.4 °C/W
RθJA Thermal Resistance Junction to Ambient(1) (2) 50 °C/W
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
GUID-7A348ED9-C9E6-4F7C-8C75-C4FDD66041CD-low.gif
Max RθJA = 50°C/W when mounted on 1 inch2 (6.45 cm2) of 2-oz. (0.071-mm thick) Cu.
GUID-67B7CE15-14B3-4B8A-989A-A6F02EE14AD1-low.gif
Max RθJA = 123°C/W when mounted on minimum pad area of 2-oz. (0.071-mm thick) Cu.