Thermal resistance active area to test point 1 (TP1) (1)
8
°C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of
the package. The cooling system must be capable of maintaining the package
within the temperature range specified in
Section 6.4. The total heat load on the DMD is largely driven by the incident light
absorbed by the active area; although other contributions include light energy
absorbed by the window aperture and electrical power dissipation of the array.
Optical systems should be designed to minimize the light energy falling outside
the window aperture since any additional thermal load in this area can
significantly degrade the reliability of the device.