JAJSJA0B July   2020  – April 2021 DLP5530S-Q1

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5.     Illumination Overfill Diagram
    6. 6.5  Thermal Information
    7. 6.6  Electrical Characteristics
    8. 6.7  Timing Requirements
    9.     Electrical and Timing Diagrams
    10. 6.8  Switching Characteristics
    11.     LPSDR and Test Load Circuit Diagrams
    12. 6.9  System Mounting Interface Loads
    13.     System Interface Loads Diagram
    14. 6.10 Physical Characteristics of the Micromirror Array
    15.     Array Physical Characteristics Diagram
    16. 6.11 Micromirror Array Optical Characteristics
    17. 6.12 Window Characteristics
    18. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sub-LVDS Data Interface
      2. 7.3.2 Low Speed Interface for Control
      3. 7.3.3 DMD Voltage Supplies
      4. 7.3.4 Asynchronous Reset
      5. 7.3.5 Temperature Sensing Diode
        1. 7.3.5.1 Temperature Sense Diode Theory
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application Overview
      2. 8.2.2 Reference Design
      3. 8.2.3 Application Mission Profile Consideration
  9. Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 DMD Handling
    7. 11.7 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • FYS|149
サーマルパッド・メカニカル・データ
発注情報

Micromirror Array Temperature Calculation

GUID-FD7BFF13-305B-4EED-BAAB-1660C5331668-low.gif Figure 7-4 DMD Thermal Test Points

The active array temperature can be computed analytically from measurement points on the outside of the package, the package thermal resistance, the electrical power, and the illumination heat load.

Relationship between array temperature and the reference ceramic temperature (thermocouple location TP1 in Figure 7-4) is provided by the following equations:

Equation 1. TARRAY = TCERAMIC + (QARRAY × RARRAY–TO–CERAMIC)
Equation 2. QARRAY = QELECTRICAL + QILLUMINATION

where

  • TARRAY = computed DMD array temperature (°C)
  • TCERAMIC = measured ceramic temperature, TP1 location in Figure 7-4 (°C)
  • RARRAY–TO–CERAMIC = DMD package thermal resistance from array to thermal test point TP1 (°C/W), see Thermal Information
  • QARRAY = total power, electrical plus absorbed, on the DMD array (W)
  • QELECTRICAL = nominal electrical power dissipation by the DMD (W)
  • QILLUMINATION = (CL2W × SL)
  • CL2W = conversion constant for screen lumens to power on the DMD (W/lm)
  • SL = measured screen lumens (lm)

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating frequencies.

Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source.

Equations shown above are valid for a 1–chip DMD system with a total projection efficiency from DMD to the screen of 87%.

The constant CL2W is based on the DMD array characteristics. It assumes a spectral efficiency of 300 lm/W for the projected light and illumination distribution of 83.7% on the active array, and 16.3% on the array border.

The following is a sample calculation for a typical projection application:

  1. SL = 50 lm
  2. CL2W = 0.00293 W/lm
  3. QELECTRICAL = 0.4 W (This number does not represent an actual DMD electrical power; for illustration purposes only)
  4. RARRAY–TO–CERAMIC = 1.1°C/W
  5. TCERAMIC = 55°C
  6. QARRAY = 0.4 W + (0.00293 W/lm × 50 lm) = 0.5465 W
  7. TARRAY = 55°C + (0.5465 W × 1.1°C/W) = 55.6°C