JAJSJF5A April   2021  – December 2021 DP83TC812R-Q1 , DP83TC812S-Q1

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Electrostatic Discharge Sensing
        3. 8.3.1.3 Time Domain Reflectometry
        4. 8.3.1.4 Voltage Sensing
        5. 8.3.1.5 BIST and Loopback Modes
          1. 8.3.1.5.1 Data Generator and Checker
          2. 8.3.1.5.2 xMII Loopback
          3. 8.3.1.5.3 PCS Loopback
          4. 8.3.1.5.4 Digital Loopback
          5. 8.3.1.5.5 Analog Loopback
          6. 8.3.1.5.6 Reverse Loopback
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Sleep Ack
      6. 8.4.6  Sleep Request
      7. 8.4.7  Sleep Fail
      8. 8.4.8  Sleep
      9. 8.4.9  Wake-Up
      10. 8.4.10 TC10 System Example
      11. 8.4.11 Media Dependent Interface
        1. 8.4.11.1 100BASE-T1 Master and 100BASE-T1 Slave Configuration
        2. 8.4.11.2 Auto-Polarity Detection and Correction
        3. 8.4.11.3 Jabber Detection
        4. 8.4.11.4 Interleave Detection
      12. 8.4.12 MAC Interfaces
        1. 8.4.12.1 Media Independent Interface
        2. 8.4.12.2 Reduced Media Independent Interface
        3. 8.4.12.3 Reduced Gigabit Media Independent Interface
        4. 8.4.12.4 Serial Gigabit Media Independent Interface
      13. 8.4.13 Serial Management Interface
      14. 8.4.14 Direct Register Access
      15. 8.4.15 Extended Register Space Access
      16. 8.4.16 Write Address Operation
        1. 8.4.16.1 MMD1 - Write Address Operation
      17. 8.4.17 Read Address Operation
        1. 8.4.17.1 MMD1 - Read Address Operation
      18. 8.4.18 Write Operation (No Post Increment)
        1. 8.4.18.1 MMD1 - Write Operation (No Post Increment)
      19. 8.4.19 Read Operation (No Post Increment)
        1. 8.4.19.1 MMD1 - Read Operation (No Post Increment)
      20. 8.4.20 Write Operation (Post Increment)
        1. 8.4.20.1 MMD1 - Write Operation (Post Increment)
      21. 8.4.21 Read Operation (Post Increment)
        1. 8.4.21.1 MMD1 - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TC812 Registers
  9. Application and Implementation
    1. 9.1 アプリケーション情報に関する免責事項
    2. 9.2 Application Information
    3. 9.3 Typical Applications
      1. 9.3.1 Design Requirements
        1. 9.3.1.1 Physical Medium Attachment
          1. 9.3.1.1.1 Common-Mode Choke Recommendations
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Metal Pour
      4. 11.1.4 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Power Supply Recommendations

The DP83TC812S-Q1 is capable of operating with a wide range of IO supply voltages (3.3 V, 2.5 V, or 1.8 V). No power supply sequencing is required. The recommended power supply de-coupling network is shown in the figure below. For improved conducted emissions, an optional ferrite bead may be placed between the supply and the PHY de-coupling network.

Typical TC-10 application block diagram along with supply and peripherals is shown below. TPS7B81-Q1 is the recommended part number to be used as 3.3V LDO for the VSLEEP rail. The low quiescent current of this LDO makes it ideal for TC-10 applications.

Figure 10-1 Typical TC-10 Application With Peripherals

When VDDIO and VDDMAC are separate, both voltage rails should have a dedicated network of ferrite bead, 0.47uF, and 0.01uF capacitors. VSLEEP can also be connected to VDDA, 0.1uF capacitor should be retained in this configuration.

Current Consumption Break-Down

The following table highlights the break down of power consumption in active mode for each supply rail, specifically highlighting the split between VDDMAC and VDDIO.

Table 10-1 Active Mode Current Consumption
VOLTAGE RAIL VOLTAGE (V) MAX CURRENT (mA)1
MII
VDDA 3.3 63
VDDIO 3.3 4
2.5 3
1.8 2
VDDMAC 3.3 20
2.5 15
1.8 11

VSLEEP

3.3 2
RMII
VDDA 3.3 63
VDDIO 3.3 6
2.5 4
1.8 3
VDDMAC 3.3 17
2.5 13
1.8 10

VSLEEP

3.3 2
RGMII
VDDA 3.3 63
VDDIO 3.3 4
2.5 3
1.8 2
VDDMAC 3.3 17
2.5 13
1.8 10

VSLEEP

3.3 2
SGMII
VDDA 3.3 95
VDDIO 3.3 4
2.5 3
1.8 2
VDDMAC 3.3 8
2.5 6
1.8 4

VSLEEP

3.3 2
  1. Current consumption measured across voltage, temperature, and process with active data communication.