JAJSSK7B December   2023  – March 2024 INA500

PRODMIX  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - INA500A
    6. 6.6 Electrical Characteristics - INA500B
    7. 6.7 Electrical Characteristics - INA500C
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gain Options and Resistors
        1. 7.3.1.1 Gain Error and Drift
      2. 7.3.2 Input Common-Mode Voltage Range
      3. 7.3.3 EMI Rejection
      4. 7.3.4 Typical Specifications and Distributions
      5. 7.3.5 Electrical Overstress
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reference Pin
    2. 8.2 Typical Applications
      1. 8.2.1 Battery Monitoring using Difference Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DBV|6
  • DCK|6
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

Attention to good layout practices is always recommended. For best operational performance of the device, use the following PCB layout practices:

  • Ensure that both input paths are well-matched for source impedance and capacitance to avoid converting common-mode signals into differential signals.
  • Use bypass capacitors to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry.
    • Connect low-ESR, 0.1µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-supply applications.
  • Route the input traces as far away from the supply or output traces as possible to reduce parasitic coupling. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better than crossing in parallel with the noisy trace.
  • Place the external components as close to the device as possible.
  • Keep the traces as short as possible.