JAJSCV2E November   2016  – August 2023 ISO7730-Q1 , ISO7731-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBQ|16
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

6.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DW-16 PACKAGE
ISSafety input, output, or supply currentRθJA = 81.4 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 6-1279mA
RθJA = 81.4 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 6-1427
RθJA = 81.4 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 6-1558
PSSafety input, output, or total powerRθJA = 81.4 °C/W, TJ = 150°C, TA = 25°C, see Figure 6-31536mW
TSMaximum safety temperature150°C
DBQ-16 PACKAGE
ISSafety input, output, or supply currentRθJA = 109.0°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 6-2209mA
RθJA = 109.0 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 6-2319
RθJA = 109.0°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 6-2417
PSSafety input, output, or total powerRθJA = 109.0°C/W, TJ = 150°C, TA = 25°C, see Figure 6-41147mW
TSMaximum safety temperature150°C
(1) The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Section 6.4 is that of a device installed on a High-K test board for leaded surface mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.