JAJSAZ6M September   2008  – October 2020 LM22678 , LM22678-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings: LM22678
    3. 6.3 Handling Ratings: LM22678-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precision Enable and UVLO
      2. 7.3.2 Soft Start
      3. 7.3.3 Bootstrap Supply
      4. 7.3.4 Internal Loop Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Current Limit
      4. 7.4.4 Thermal Protection
      5. 7.4.5 Duty-Cycle Limits
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Divider Selection
      2. 8.1.2 Power Diode
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Buck Regulator Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Components
            1. 8.2.1.2.1.1 Inductor
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Output Capacitor
          4. 8.2.1.2.4 Bootstrap Capacitor
        3. 8.2.1.3 Application Curves
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 サポート・リソース
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.5 Thermal Information

THERMAL METRIC(1)(2)LM22678,
LM22678-Q1		UNIT
NDR
7 PINS
RθJAJunction-to-ambient thermal resistance22°C/W
(1) For more information about traditional and new thermal metrics, see the application report IC Package Thermal Metrics (SPRA953).
(2) The value of RθJA for the PFM package of 22°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 20 to 30°C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 (SNVA328) for more information.