SNVS970C March   2013  – October 2014 LM3279

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 System Characteristics Recommended Capacitance Specifications
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Dynamically Adjustable Output Voltage
      2. 7.3.2  Seamless Mode Transition
      3. 7.3.3  Setting The Output Voltage
      4. 7.3.4  General Purpose Outputs
      5. 7.3.5  VCONON
      6. 7.3.6  RDSON Management
      7. 7.3.7  Supply Current Limit
      8. 7.3.8  Reverse Current Limit
      9. 7.3.9  VCON Overvoltage Clamp
      10. 7.3.10 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable And Shutdown Mode
      2. 7.4.2 Low-Power Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 PFM Mode
    5. 7.5 Programming
      1. 7.5.1 Digital Control Serial Bus Interface
      2. 7.5.2 Supported Command Sequences
      3. 7.5.3 Device Enumeration
      4. 7.5.4 I/O
      5. 7.5.5 Control Interface Timing Parameters
    6. 7.6 Registers
      1. 7.6.1 Programmable Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application Circuit: Digital Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Current Capability
          2. 8.2.1.2.2 Recommended External Components
            1. 8.2.1.2.2.1 Inductor Selection
            2. 8.2.1.2.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Circuit: Analog Control
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB
        1. 10.1.1.1 Energy Efficiency
        2. 10.1.1.2 EMI
    2. 10.2 Layout Examples
      1. 10.2.1 LM3279 RF Evaluation Board
      2. 10.2.2 Component Placement
    3. 10.3 DSBGA Package Assembly And Use
    4. 10.4 Manufacturing Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

See TI Application Note AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009) for general information about the DSBGA package.

11.3 Trademarks

MIPI is a registered trademark of Mobil Industry Processor Interface Alliance .

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.