SNVS796D August   2011  – October 2015 LM3556

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration And Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-Amplifier Synchronization (TX)
      2. 7.3.2 Input Voltage Flash Monitor (IVFM)
      3. 7.3.3 Fault Protections
        1. 7.3.3.1 Fault Operation
        2. 7.3.3.2 Flash Time-Out
        3. 7.3.3.3 Overvoltage Protection (OVP)
        4. 7.3.3.4 Current Limit
        5. 7.3.3.5 NTC Thermistor Input (TEMP)
        6. 7.3.3.6 Undervoltage Lockout (UVLO)
        7. 7.3.3.7 Thermal Shutdown (TSD)
        8. 7.3.3.8 LED and/or VOUT Fault
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-Up (Enabling The Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Flash Mode
      4. 7.4.4 Torch Mode
      5. 7.4.5 Indicator Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Transferring Data
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  Silicon Revision and Filter Time Register (0x00)
        2. 7.6.1.2  Input Voltage Flash Monitor (IVFM) Mode Register (0x01)
        3. 7.6.1.3  NTC Settings Register (0x02)
        4. 7.6.1.4  Indicator Ramp Time Indicator (0x03)
        5. 7.6.1.5  Indicator Blinking Register (0x04)
        6. 7.6.1.6  Indicator Period Count Register (0x05)
        7. 7.6.1.7  Torch Ramp Time Register (0x06)
        8. 7.6.1.8  Configuration Register (0x07)
        9. 7.6.1.9  Flash Features Register (0x08)
        10. 7.6.1.10 Current Control Register (0x09)
        11. 7.6.1.11 Enable Register (0x0A)
          1. 7.6.1.11.1 Enable Register Mode Bits
          2. 7.6.1.11.2 Control Logic Delays
        12. 7.6.1.12 Flags Register (0x0B)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 NTC Thermistor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device And Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, And Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
VIN, VSW ,VOUT –0.3 6 V
VSCL, VSDA, VENABLE, VSTROBE, VTX, VTORCH, VLED, VTEMP −0.3 V to the lesser of (VIN + 0.3 V) w/ 6 V maximum
Continuous power dissipation(3) Internally limited
Junction temperature, TJ-MAX 150 °C
Maximum lead temperature (soldering)   See(4) °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.
(4) For detailed soldering specifications and information, refer to Texas Instruments Application Note 1112: DSBGA Wafer Level chip Scale Package (SNVA009).

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN NOM MAX UNIT
VIN 2.5 5.5 V
Junction temperature, TJ −40 125 °C
Ambient temperature, TA(2) −40 85 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

THERMAL METRIC(1) LM3556 UNIT
YFQ (DSBGA)
16 PINS
RθJA(2) Junction-to-ambient thermal resistance 60 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm × 76 mm × 1.6 mm with a 2 × 1 array of thermal vias. The ground plane on the board is 50 mm × 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5 oz/1 oz/1 oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1 W.

6.5 Electrical Characteristics

Unless otherwise specified, VIN = 3.6 V, typical limits apply for TA = 25°C, and minimum (MIN) and maximum (MAX) limits apply over the full operating ambient temperature range (−40°C ≤ TA ≤ +85°C).(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENT SOURCE SPECIFICATIONS
ILED Current source accuracy 1.5-A Flash, VOUT = 4 V 1.425
(–5%) 		1.5 1.575
(+5%) 		A
46.88-mA Torch, VOUT = 3.6 V 42.3 (−10%) 47 51.7 (+10%) mA
VHR Current source regulation voltage ILED = 1.5 A Flash 250 280 (+12%) mV
ILED = 46.88 mA Torch 150 172.5 (+15%)
VOVP Output overvoltage protection trip point ON Threshold 4.86 5 5.1 V
OFF Threshold 4.75 4.88 4.99
STEP-UP DC-DC CONVERTER SPECIFICATIONS
RPMOS PMOS switch on-resistance IPMOS = 1 A 85 mΩ
RNMOS NMOS switch on-resistance INMOS = 1 A 65
ICL Switch current limit −12% 1.7 12% A
−12% 1.9 12%
−10% 2.5 10%
−12% 3.1 12%
VTRIP NTC comparator trip threshold Configuration Register, bit [1] = 1 −6% 600 6% mV
UVLO Undervoltage lockout threshold Falling VIN 2.74 2.8 2.85 V
INTC NTC current −6% 75 6% µA
VIVFM Input voltage flash monitor trip threshold –3.2% 2.9 3.2% V
ƒSW Switching frequency 2.5 V ≤ VIN ≤ 5.5 V 3.72 4 4.28 MHz
IQ Quiescent supply current Device not switching Pass Mode 0.6 0.75 mA
ISD Shutdown supply current Device disabled, EN = 0V
2.5 V ≤ VIN ≤ 5.5 V		 0.1 1.3 µA
ISB Standby supply current Device disabled, EN = 2 V
2.5 V ≤ VIN ≤ 5.5 V		 2.5 4 µA
tTX Flash-to-torch LED current settling time TX low to high,
ILED = 1.5 A to 46.88 mA		 4 µs
IOS ILED overshoot in external indicator mode 0 mA to ITORCH 8%
ENABLE, STROBE, TORCH, TX VOLTAGE SPECIFICATIONS
VIL Input logic low 2.5 V ≤ VIN ≤ 5.5 V 0 0.4 V
VIH Input logic high 1.2 VIN
I2C-COMPATIBLE INTERFACE SPECIFICATIONS (SCL, SDA)
VIL Input logic low 2.5 V ≤ VIN ≤ 4.2 V 0 0.4 V
VIH Input logic high 1.2 VIN
VOL Output logic low ILOAD = 3 mA 400 mV
(1) Minimum and maximum limits are specified by design, test, or statistical analysis. Typical numbers are not verified, but do represent the most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6 V and TA = 25°C.
(2) All voltages are with respect to the potential at the GND pin.

6.6 Timing Requirements

MIN NOM MAX UNIT
t1 SCL clock frequency 2.4 µs
t2 Data in setup time to SCL high 100 ns
t3 Data out stable after SCL low 0 ns
t4 SDA low setup time to SCL low (start) 100 ns
t5 SDA high hold time after SCL high (stop) 100 ns
LM3556 30171819.gif Figure 1. I2C-Compatible Timing Diagram

6.7 Typical Characteristics

LM3556 30171890.gif
VLED = 3.6 V ILED = 1.5 A
Figure 2. Flash LED Current vs VIN
LM3556 30171894.gif
VLED = 3.8 V
Figure 4. Flash LED Efficiency vs Flash LED Current
LM3556 30171898.gif
VLED = 3 V
Figure 6. Torch LED Efficiency vs VIN
LM3556 30171889.gif
EN = 0 V
Figure 8. IQ Shutdown vs VIN
LM3556 30171865.gif
Figure 10. Frequency With VIN and Over Temperature
LM3556 30171869.gif
Current Limit = 1.9 A
Figure 12. Input Current Limit Over Temperature and VIN
LM3556 30171871.gif
Current Limit = 3.1 A
Figure 14. Input Current Limit Over Temperature and VIN
LM3556 30171825.gif
400 ms
Figure 16. Strobe With Edge-Triggered Signal
LM3556 30171835.gif
Figure 18. Internal Indicator Operation
LM3556 30171838.gif
Figure 20. Input Voltage Flash Monitor Stop and Hold Mode With Default Settings
LM3556 30171840.gif
Figure 22. Input Voltage Flash Monitor Up and Down Mode With Default Settings
LM3556 30171842.gif
0-mV Hysteresis 512-ms Filter Time
Figure 24. Input Voltage Flash Monitor, Up and Down Mode
LM3556 30171844.gif
Figure 26. Impact on LED Current With a TX Event
LM3556 30171854.gif
Figure 28. Transient Plot When VIN Stepped from 3 → 2.9 V
LM3556 30171891.gif
VLED = 3.6 V ILED = 1.5 A
Figure 3. Flash LED Efficiency vs VIN
LM3556 30171899.gif
VLED = 3 V ILED = 375 mA
Figure 5. Torch LED Current vs VIN
LM3556 30171895.gif
EN = 1.8 V
Figure 7. IQ Standby vs VIN
LM3556 30171864.gif
Figure 9. Variation of OVP With VIN
LM3556 30171866.gif
Current Limit = 1.7 A
Figure 11. Input Current Limit Over Temperature and VIN
LM3556 30171870.gif
Current Limit = 2.5 A
Figure 13. Input Current Limit Over Temperature and VIN
LM3556 30171824.gif
Current Limit = 1.7 A
Figure 15. Start-Up Plot With Part In Boost Mode Current Limit
LM3556 30171826.gif
400 ms
Figure 17. Strobe With Level-Triggered Signal
LM3556 30171837.gif
Figure 19. Input Voltage Flash Monitor Report Mode With Default Settings
LM3556 30171839.gif
Figure 21. Input Voltage Flash Monitor Down Mode With Default Settings
LM3556 30171841.gif
0-mV Hysteresis 1/2 Step Filter Time
Figure 23. Input Voltage Flash Monitor, Up and Down Mode
LM3556 30171843.gif
256-µs Flash Ramp 1/2 Step Filter Time
Figure 25. Input Voltage Flash Monitor, Up and Down Mode
LM3556 30171845.gif
Figure 27. Time Taken for LM3556 to Ramp from Torch to Flash After TX Event