JAJSC51E November   2004  – March 2016 LM5107

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics
    6. 6.6 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 HS Transient Voltages Below Ground
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10デバイスおよびドキュメントのサポート
    1. 10.1 コミュニティ・リソース
    2. 10.2 商標
    3. 10.3 静電気放電に関する注意事項
    4. 10.4 Glossary
  11. 11メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

D and NGT Packages
8-Pin SOIC, WSON
Top View
LM5107 20130002.gif

Pin Functions(1)

Pin # Name Description Application Information
SOIC WSON
1 1 VDD Positive gate drive supply Locally decouple to VSS using low ESR/ESL capacitor located as close to IC as possible.
2 2 HI High side control input The LM5107 HI input is compatible with TTL input thresholds. Unused HI input should be tied to ground and not left open
3 3 LI Low side control input The LM5107 LI input is compatible with TTL input thresholds. Unused LI input should be tied to ground and not left open.
4 4 VSS Ground reference All signals are referenced to this ground.
5 5 LO Low side gate driver output Connect to the gate of the low side N-MOS device.
6 6 HS High side source connection Connect to the negative terminal of the bootstrap capacitor and to the source of the high side N-MOS device.
7 7 HO High side gate driver output Connect to the gate of the low side N-MOS device.
8 8 HB High side gate driver positive supply rail Connect the positive terminal of the bootstrap capacitor to HB and the negative terminal of the bootstrap capacitor to HS. The bootstrap capacitor should be placed as close to IC as possible.
(1) For WSON package it is recommended that the exposed pad on the bottom of the LM5107 be soldered to ground plane on the PCB board and the ground plane should extend out from underneath the package to improve heat dissipation.