SNWS022D January   2010  – June 2015 LMH2110

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 2.7-V and 4.5-V DC and AC Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Accurate Power Measurement
      2. 7.3.2 Types of RF Detectors
        1. 7.3.2.1 Peak Detectors
        2. 7.3.2.2 LOG Amp Detectors
        3. 7.3.2.3 RMS Detectors
      3. 7.3.3 LMH2110 RF Power Detector
        1. 7.3.3.1 RF Input
        2. 7.3.3.2 Enable
        3. 7.3.3.3 Output
        4. 7.3.3.4 Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application With Transmit Power Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Specifying Detector Performance
            1. 8.2.1.2.1.1 Dynamic Range
            2. 8.2.1.2.1.2 Log Conformance Error
            3. 8.2.1.2.1.3 Variation Over Temperature Error
            4. 8.2.1.2.1.4 1-dB Step Error
            5. 8.2.1.2.1.5 10-dB Step Error
            6. 8.2.1.2.1.6 Variation Due to Modulation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application With Resistive Divider
      3. 8.2.3 Application With Low-Pass Output Filter for Residual Ripple Reduction
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply voltage  VBAT – GND 5.5 V
RF input  Input power 12 dBm
 DC voltage 1 V
Enable input voltage GND – 0.4 < VEN and VEN< Min (VDD – 0.4 V, 3.6 V)
Junction temperature(3) 150 °C
Maximum lead temperature (Soldering,10 sec) 260 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine Model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage 2.7 5 V
Operating temperature −40 85 °C
RF frequency 50 8000 MHz
RF input power −40 5 dBm
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.4 Thermal Information

THERMAL METRIC(1) LMH2110 UNIT
YFQ (DSBGA)
6 PINS
RθJA Junction-to-ambient thermal resistance 133.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.7 °C/W
RθJB Junction-to-board thermal resistance 22.6 °C/W
ψJT Junction-to-top characterization parameter 5.7 °C/W
ψJB Junction-to-board characterization parameter 22.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 2.7-V and 4.5-V DC and AC Electrical Characteristics

Unless otherwise specified: all limits are ensured to TA = 25°C, VBAT = 2.7 V and 4.5 V (worst of the 2 is specified),
RFIN = 1900 MHz CW (Continuous Wave, unmodulated).(1)
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
SUPPLY INTERFACE
IBAT Supply current Active mode: EN = HIGH, no signal present at RFIN 3.7 4.8 5.5 mA
Active mode: EN = HIGH, no signal present at RFIN
Limits apply at temperature extremes.		 2.9 5.9
Shutdown: EN = LOW, no signal present at RFIN. VBAT = 2.7 V 3.7 4.7 μA
VBAT = 4.5 V 4.6 5.7
Shutdown: EN = LOW, no signal present at RFIN.
Limits apply at temperature extremes.		 VBAT = 2.7 V 5 μA
VBAT = 4.5 V 6.1
EN = Low, RFIN = 0 dBm, 1900 MHz VBAT = 2.7V 3.5 4.7 μA
VBAT = 4.5 V 4.6 5.7
EN = Low, RFIN = 0 dBm, 1900 MHz
Limits apply at temperature extremes.		 VBAT = 2.7 V 5 μA
VBAT = 4.5 V 6.1
PSRR Power Supply Rejection Ratio(4) RFIN = −10 dBm, 1900 MHz, 2.7V < VBAT < 5 V 56 dB
RFIN = −10 dBm, 1900 MHz, 2.7V < VBAT < 5 V
Limits apply at temperature extremes.		 45
LOGIC ENABLE INTERFACE
VLOW EN logic low input level (Shutdown mode) Limits apply at temperature extremes. 0.6 V
VHIGH EN logic high input level Limits apply at temperature extremes. 1.1 V
IEN Current into EN pin Limits apply at temperature extremes. 50 nA
INPUT/OUTPUT INTERFACE
RIN Input resistance 44 50 56 Ω
VOUT Minimum output voltage (pedestal) No input signal 1.5 mV
No input signal, limits apply at temperature extremes 0 8
ROUT Output impedance EN = High, RFIN = –10 dBm, 1900 MHz, ILOAD = 1 mA, DC measurement 0.2 2 Ω
EN = High, RFIN = –10 dBm, 1900 MHz, ILOAD = 1 mA,
DC measurement, limits apply at temperature extremes.		 3
IOUT Output short circuit current Sinking, RFIN = –10 dBm, OUT connected to 2.5 V 37 42 mA
Sinking, RFIN = –10 dBm, OUT connected to 2.5 V
Limits apply at temperature extremes.		 32
Sourcing, RFIN = –10 dBm, OUT connected to GND 40 46
Sourcing, RFIN = –10 dBm, OUT connected to GND
Limits apply at temperature extremes.		 34
IOUT,SD Output leakage current in shutdown mode EN = Low, OUT connected to 2 V
Limits apply at temperature extremes.		 50 nA
en Output referred noise(4) RFIN = −10 dBm, 1900 MHz, output spectrum at 10 kHz 3 µV√Hz
VN Integrated output referred noise(4) Integrated over frequency band
1 kHz – 6.5 kHz, RFIN = –10 dBm, 1900 MHz		 210 µVRMS
RF DETECTOR TRANSFER
RFIN = 50 MHz (fit range –20 dBm to –10 dBm)(5)
PMIN Minimum power level, bottom end of dynamic range Log conformance error within ±1 dB –39 dBm
PMAX Maximum power level, top end of dynamic range Log conformance error within ±1 dB 7 dBm
VMIN Minimum output voltage At PMIN 3 mV
VMAX Maximum output voltage At PMAX 1.96 V
KSLOPE Logarithmic slope 42.2 44.3 46.4 mV/dB
PINT Logarithmic Intercept –38.6 –38.3 –38.0 dBm
DR Dynamic Range for specified accuracy ±1-dB Log conformance error (ELC) 46 dB
±1-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 45
±3-dB Log Conformance Error (ELC) 51
±3-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 50
±0.5-dB input referred variation over temperature (EVOT), from PMIN
Limits apply at temperature extremes.		 42
RF DETECTOR TRANSFER
RFIN = 900 MHz (fit range –20 dBm to –10 dBm)(5)
PMIN Minimum power level, bottom end of dynamic range Log conformance error within ±1 dB –38 dBm
PMAX Maximum power level, top end of dynamic range Log conformance error within ±1 dB 0 dBm
VMIN Minimum output voltage At PMIN 3 mV
VMAX Maximum output voltage At PMAX 1.58 V
KSLOPE Logarithmic slope 41.8 43.9 46 mV/dB
PINT Logarithmic intercept –37.4 –37 –36.7 dBm
DR Dynamic range for specified accuracy ±1-dB Log conformance error (ELC) 38 dB
±1-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 37
±3-dB Log conformance error (ELC) 45
±3-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 44
±0.5-dB Input referred variation over temperature (EVOT), from PMIN
Limits apply at temperature extremes.		 44
±0.3-dB Error for a 1dB Step (E1dB STEP) 41
±0.3-dB Error for a 1dB Step (E1dB STEP)
Limits apply at temperature extremes.		 38
±1-dB Error for a 10dB Step (E10dB 30 STEP)
Limits apply at temperature extremes.		 32
EMOD Input-referred variation due to modulation W-CDMA Release 6/7/8,
–38 dBm < RFIN < –5 dBm		 0.08 dB
LTE, –38 dBm < RFIN < –5 dBm 0.19
RF DETECTOR TRANSFER
RFIN = 1900 MHz (fit range –20 dBm to –10 dBm)(5)
PMIN Minimum power level, bottom end of dynamic range Log conformance error within ±1 dB –36 dBm
PMAX Maximum power level, top end of dynamic range Log conformance error within ±1 dB 0 dBm
VMIN Minimum output voltage At PMIN 3 mV
VMAX maximum output voltage At PMAX 1.5 V
KSLOPE Logarithmic slope 41.8 43.9 46.1 mV/dB
PINT Logarithmic Intercept –35.5 –35.1 –34.7 dBm
DR Dynamic range for specified accuracy ±1-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 36 dB
±3-dB Log conformance Error (ELC) 45
±3-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 43
±0.5-dB Input referred variation over temperature (EVOT), from PMIN
Limits apply at temperature extremes.		 41
±0.3-dB error for a 1-dB Step (E1dB STEP) 40
±0.3-dB error for a 1-dB Step (E1dB STEP)
Limits apply at temperature extremes.		 38
±1-dB error for a 10-dB Step (E10-dB 30 STEP)
Limits apply at temperature extremes.		 30
EMOD Input-referred variation due to modulation W-CDMA Release 6/7/8,
–38 dBm < RFIN < –5 dBm		 0.09 dB
LTE, –38 dBm < RFIN < –5 dBm 0.18
RFIN = 3500 MHz, fit range –15 dBm to –5 dBm(5)
PMIN Minimum power level, bottom end of dynamic range Log conformance error within ±1 dB –31 dBm
PMAX Maximum power level, top end of dynamic range Log conformance error within ±1 dB 6 dBm
VMIN Minimum output voltage At PMIN 2 mV
VMAX Maximum output voltage At PMAX 1.52 V
KSLOPE Logarithmic slope 41.8 44 46.1 mV/dB
PINT Logarithmic Intercept –30.5 –29.7 –28.8 dBm
DR Dynamic range for specified accuracy ±1-dB Log conformance error (ELC) 37 dB
±1-dB Log conformance error (ELC)
Limits apply at temperature extremes. 		36
±3-dB Log conformance error (ELC) 44
±3-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 42
±0.5-dB Input referred variation over temperature (EVOT), from PMIN
Limits apply at temperature extremes.		 39
RFIN = 5800 MHz, fit range –20 dBm to 3 dBm(5)
PMIN Minimum power level, bottom end of dynamic range Log conformance error within ±1 dB –22 dBm
PMAX Maximum power level, top end of dynamic range Log conformance error within ±1 dB 10 dBm
VMIN Minimum output voltage At PMIN 3 mV
VMAX Maximum output voltage At PMAX 1.34 V
KSLOPE Logarithmic slope 42.5 44.8 47.1 mV/dB
PINT Logarithmic Intercept –22 –21 –19.9 dBm
DR Dynamic range for specified accuracy ±1-dB Log conformance error (ELC) 32 dB
±1-dB Log conformance error (ELC)
Limits apply at temperature extremes. 		31
±3-dB Log conformance error (ELC) 39
±3-dB Log conformance error (ELC)
Limits apply at temperature extremes.		 37
±0.5-dB Input referred variation over temperature (EVOT), from PMIN
Limits apply at temperature extremes.		 33
(1) 2.7-V and 4.5-V DC and AC Electrical Characteristics values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. Parametric performance is not ensured in the 2.7-V and 4.5-V DC and AC Electrical Characteristics under conditions of internal self-heating where TJ > TA.
(2) All limits are specified by test or statistical analysis.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.
(4) This parameter is specified by design and/or characterization and is not tested in production.
(5) All limits are specified by design and measurements which are performed on a limited number of samples. Limits represent the mean ±3–sigma values. The typical value represents the statistical mean value.

6.6 Timing Requirements

MIN NOM MAX UNIT
tON Turnon time from shutdown
RFIN = –10 dBm, 1900 MHz, EN LOW-HIGH transition to OUT at 90%		 15 19 µs
tR Rise time(1)
Signal at RFIN from –20 dBm to 0 dBm, 10% to 90%, 1900 MHz		 2.2 µs
tF Fall time (1)
Signal at RFIN from 0 dBm to –20 dBm, 90% to 10%, 1900 MHz		 31 µs
(1) This parameter is specified by design and/or characterization and is not tested in production.

6.7 Typical Characteristics

Unless otherwise specified: TA = 25°C, VBAT = 2.7 V, RFIN = 1900 MHz CW (Continuous Wave, unmodulated). Specified errors are input referred.
LMH2110 30064811.gifFigure 1. Supply Current vs. Supply Voltage (Active)
LMH2110 30064814.gifFigure 3. Supply Current vs. Enable Voltage (EN)
LMH2110 30064861_nws022.gifFigure 5. Sourcing Output Current vs. RF Input Power
LMH2110 30064865.gifFigure 7. RF Input Impedance vs. Frequency,
Resistance (R) and Reactance (X)
LMH2110 30064864.gifFigure 9. Output Voltage Noise vs. Frequency
LMH2110 30064816.gifFigure 11. Log Intercept vs. Frequency
LMH2110 30064820.gifFigure 13. Log Conformance Error (50 Units) vs.
RF Input Power at 50 MHz
LMH2110 30064822.gifFigure 15. Temperature Variation (50 Units) vs.
RF Input Power at 50 MHz
LMH2110 30064828.gifFigure 17. Log Conformance Error (50 Units) vs.
RF Input Power at 900 MHz
LMH2110 30064830.gifFigure 19. Temperature Variation (50 Units) vs.
RF Input Power at 900 MHz
LMH2110 30064832.gifFigure 21. 10 dB Power Step Error vs.
RF Input Power at 900 MHz
LMH2110 30064834.gifFigure 23. LTE Variation vs.
RF Input Power at 900 MHz
LMH2110 30064839.gifFigure 25. Log Conformance Error (50 Units) vs.
RF Input Power at 1900 MHz
LMH2110 30064841.gifFigure 27. Temperature Variation (50 Units) vs.
RF Input Power at 1900 MHz
LMH2110 30064843.gifFigure 29. 10-dB Power Step Error vs.
RF Input Power at 1900 MHz
LMH2110 30064845.gifFigure 31. LTE Input referred Variation vs.
RF Input Power at 1900 MHz
LMH2110 30064850.gifFigure 33. Log Conformance Error (50 Units) vs.
RF Input Power at 3500 MHz
LMH2110 30064852.gifFigure 35. Temperature Variation (50 Units) vs.
RF Input Power at 3500 MHz
LMH2110 30064858.gifFigure 37. Log Conformance Error (50 Units) vs.
RF Input Power at 5800 MHz
LMH2110 30064860.gifFigure 39. Temperature Variation (50 Units) vs.
RF Input Power at 5800 MHz
LMH2110 30064867.gifFigure 41. Temperature Variation vs.
RF Input Power at 8000 MHz
LMH2110 30064812.gifFigure 2. Supply Current vs. Supply Voltage (Shutdown)
LMH2110 30064813.gifFigure 4. Supply Current vs. RF Input Power
LMH2110 30064862_nws022.gifFigure 6. Sinking Output Current vs. RF Input Power
LMH2110 30064863.gifFigure 8. Power Supply Rejection Ratio vs. Frequency
LMH2110 30064815.gifFigure 10. Log Slope vs. Frequency
LMH2110 30064819.gifFigure 12. Output Voltage and Log Conformance Error vs.
RF Input Power at 50 MHz
LMH2110 30064821.gifFigure 14. Temperature Variation vs.
RF Input Power at 50 MHz
LMH2110 30064827.gifFigure 16. Output Voltage and Log Conformance Error vs.
RF Input Power at 900 MHz
LMH2110 30064829.gifFigure 18. Temperature Variation vs.
RF Input Power at 900 MHz
LMH2110 30064831.gifFigure 20. 1-dB Power Step Error vs.
RF Input Power at 900 MHz
LMH2110 30064833.gifFigure 22. W-CDMA Variation vs.
RF Input Power at 900 MHz
LMH2110 30064838.gifFigure 24. Output Voltage and Log Conformance Error vs.
RF Input Power at 1900 MHz
LMH2110 30064840.gifFigure 26. Temperature Variation vs.
RF Input Power at 1900 MHz
LMH2110 30064842.gifFigure 28. 1-dB Power Step Error vs.
RF Input Power at 1900 MHz
LMH2110 30064844.gifFigure 30. W-CDMA Variation vs.
RF Input Power at 1900 MHz
LMH2110 30064849.gifFigure 32. Output Voltage and Log Conformance Error vs.
RF Input Power at 3500 MHz
LMH2110 30064851.gifFigure 34. Temperature Variation vs.
RF Input Power at 3500 MHz
LMH2110 30064857.gifFigure 36. Output Voltage and Log Conformance Error vs.
RF Input Power at 5800 MHz
LMH2110 30064859.gifFigure 38. Temperature Variation vs.
RF Input Power at 5800 MHz
LMH2110 30064866.gifFigure 40. Output Voltage and Log Conformance Error vs.
RF Input Power at 8000 MHz